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HY-BI300R Aoi Test is an advanced 2D+3D integrated AOI inspection platform designed for high-end semiconductor packaging applications, combining wire bond and die surface inspection with height-sensitive 3D measurement capabilities.
Brand :
HYRNUSItem No. :
HY-BI300ROrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAOI Inspection Equipment for Semiconductor Packaging Applications
Product IntroductionHY-BI300R AOI Inspection detects the full spectrum of wire bonding defects—breakage, missing bonds, offset, cross-wire shorts, sag, loop height deviation, and pitch variation—alongside die surface defects including chipping, scratching, contamination, epoxy coverage, and chip tilt, while adding critical 3D functionality for gold ball height profiling, wire loop geometry, and substrate warpage assessment. Built upon 85 patented technologies with iterative core algorithm refinement, the HY-BI300R delivers 3.2 μm resolution in both 2D and 3D modes with ±10 μm loop height measurement accuracy and 100% full inspection coverage. The proprietary point cloud algorithm, ultra-depth-of-field fusion, and multi-channel illumination enable reliable defect detection on complex, high-density interconnects. AI-assisted programming simplifies recipe creation while real-time re-judgment and closed-loop data traceability drive continuous process optimization. Supporting both offline and in-line configurations with seamless production line integration, this inspection system delivers the precision, stability, and data intelligence required for automotive electronics, optical devices, and high-reliability semiconductor manufacturing environments.
Application Scenarios
Upgraded with 3D functionality based on 2D inspection
Suitable for product lines with height sensitive features, such as gold ball height, wire loop height, and device warpage
Key Algorithm & Performance Features
Point cloud algorithms overcome imaging difficulties in scenarios with crossed wires and large depth of field. The 2D+3D integrated inspection meets the stringent inspection standards of high-end products. With multi-layer image acquisition and wire width percentage-based defect judgment, the system unblocks the data link and forms a full-process closed-loop management of "real-time inspection – precise analysis – process optimization".
RGB Multi-Channel Light Source
Multi-Channel Fusion Technology
Gold Wire Extraction Algorithm
High-Speed Flying Capture
Ultra-Deep Focus Synthesis
High-Precision 3D Inspection
AI-Assisted Programming
Inspection Result Re-Judgment
Product Features
Cross-wire short circuit, abnormal wire loop, broken wire, gold / aluminum ball offset, cold joint, uneven wire diameter
Surface scratches, chipping, foreign particles, adhesive residue, cracks, poor marking
Pad oxidation, contamination, dimensional deviation
Solves single-layer cross-wire inspection issues
Supports multi-layer algorithms and wire width percentage defect detection
Significantly outperforms traditional 3D line-scan technology in precision and frame rate
Supports standalone offline or in-line production
Self-developed point cloud algorithm + ultra-depth-of-field fusion technology for wire bond and die appearance inspection in cross-wire and ultra-large depth-of-field scenarios
Portable and user-friendly interface with guided programmingKey Specifications| Item | Specification |
| 2D Pixel Accuracy | 3.2 μm |
| Field of View (FOV) | 22 mm × 22 mm |
| Depth of Field | 200 μm |
| Compatible Product Size | 50–300 mm (L) × 50–100 mm (W) × 0.1–30 mm (H) |
| Compatible Magazine Size | 60–310 mm (L) × 60–110 mm (W) × 110–170 mm (H) |
| 2D Inspection Accuracy | ±2 μm |
| Full Inspection | 100% |
| Loop Height Measurement Accuracy | ±10 μm |
Parameter Specifications| Item | Specification |
| Equipment Name | Wire Bond & Chip Appearance Inspection Machine |
| Equipment Model / Model | HY-BI300R |
| 2D/3D Accuracy | 2D: 3.2 μm3D: 3.2 μm |
| Field of View (FOV) | 22 mm × 22 mm |
| Detectable Bond Defects | Defect width ≥ 3 Pixel, contrast ≥ 30 bit:No bond, bond offset, bond size, bond thickness, golf ball |
| Detectable Wire Defects | Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Misplaced wire, missing wire, broken wire, wire offset (serpentine loop), re-bond, wire sag, bridged wire, excess tail, vertical wire, loop height, wire pitch |
| Detectable Chip Defects | Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Chip chipping, chip rotation, chip missing, die crack/chipped edge, ink spot, offset, scratch, foreign material contamination, epoxy coverage, chip tilt |
| Substrate Size | 50–300 mm (L) × 50–100 mm (W) × 0.1–30 mm (H) |
| Compatible Magazine Carrier Size | 60–310 mm (L) × 60–110 mm (W) × 110–170 mm (H) |
| Equipment Dimensions | 2322 × 1300 × 1700 mm |
| Weight | 1500 kg ± 5% |
| Power Consumption | 2.5 kW |
Inspection Items
|
Wire Breakage |
Missing Bond |
Scratches |
Misalignment / Angular Deviation |
|
Wire Bundling |
Bond Pad Misalignment |
Cracking |
Silver Glue/Epoxy Overflow |
|
Wire Collapse |
Abnormal Ball Diameter |
Oxidation |
Chipping |
|
Abnormal Wire Arc |
Chip Appearance Defects |
Contamination |
Missing Chip |
Product Details
FAQs
Our systems detect wire bonding defects including breakage, missing bonds, cross-wire shorts, ball offset, cold joints, and abnormal arcs, plus die surface defects like scratches, chipping, contamination, cracks, and adhesive residue. The HY-BI300R adds 3D measurement for ball height, wire loop profile, and substrate warpage.
Proprietary point cloud algorithms combined with ultra-depth-of-field fusion and multi-layer image acquisition overcome cross-wire and large depth-of-field challenges. Multi-channel RGB lighting ensures reliable defect detection on complex, densely populated interconnects.
Yes. Both models support standalone offline operation or in-line integration with die bonding, wire bonding, and singulation processes. Guided programming and AI-assisted setup enable rapid recipe creation and seamless workflow adoption.
100% full inspection with ±2 μm accuracy reduces manual inspection labor, catches defects early to prevent downstream yield loss, and delivers production data traceability for continuous process optimization—translating directly to higher first-pass yield, lower scrap costs, and enhanced customer confidence in high-reliability automotive and industrial-grade applications.
HY-BI300P Aoi Machine is equiped with Post Semiconductor Packaging 2D+3D Full Dimension Quality Control Equipment covers all defects in wire bonding (gold wire / aluminum wire bonding) and chip appearance.
HY-BI300 Aoi Equipment is a fully automatic 2D AOI inspection system engineered for semiconductor back-end quality assurance, addressing wire bonding and die surface defects across SIP, COB, IC, power devices, optical communication, and LED packaging applications.
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