High Performance Wire Bonding & Chip Appearance Inspection Machine

Point cloud algorithms overcome imaging challenges in scenarios with crossed wires and large depth of field. The 2D+3D dual mode inspection allows 2D to cover full appearance defects, while 3D accurately measures wire loop height to meet strict inspection standards for high end products.With multi layer image acquisition and wire width percentage based defect judgment, the system unblocks the data link and forms a full process closed loop management of “real time inspection – precise analysis – process optimization”.

RGB Multi-Channel Light Source

Multi-Channel Fusion Technology

Gold Wire Extraction Algorithm

High-Speed Flying Capture

Ultra-Deep Focus Synthesis

High-Precision 3D Inspection

AI-Assisted Programming

Inspection Result Re-Judgment

Product Features

Cross-wire short circuit, abnormal wire loop, broken wire, gold / aluminum ball offset, cold joint, uneven wire diameter

Surface scratches, chipping, foreign particles, adhesive residue, cracks, poor marking

Pad oxidation, contamination, dimensional deviation

Solves single-layer cross-wire inspection issues

Supports multi-layer algorithms and wire width percentage defect detection

Significantly outperforms traditional 3D line-scan technology in precision and frame rate

Supports standalone offline or in-line production

Self-developed point cloud algorithm + ultra-depth-of-field fusion technology for wire bond and die appearance inspection in cross-wire and ultra-large depth-of-field scenarios

Portable and user-friendly interface with guided programming

Key Specifications

Item	Specification
Pixel Resolution	3.2 μm
2D Inspection Accuracy	±2 μm
Full Inspection	100%
Loop Height Measurement	±10 μm
2D Pixel Resolution	2.5 μm
2D Field of View (FOV)	10 mm × 10 mm
3D Pixel Resolution	3.2 μm
3D Field of View (FOV)	22 mm × 22 mm
Depth of Field	200 μm
Compatible Product Dimensions	50~300 mm (L) × 50~300 mm (W) × 0.1~30 mm (H)

Parameter Specifications

Item	Parameter
Equipment Name	Wire Bond & Die Visual Inspection Machine
Model	HY-BI300P
2D/3D Accuracy	2D: 2.5 µm
	3D: 3.2 µm
Field of View	2D: 10 mm × 10 mm
	3D: 22 mm × 22 mm
Detectable Solder Joint Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:No bond, bond offset, bond size, bond thickness, golf ball defect
Detectable Wire Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Mis-wire, missing wire, broken wire, wire offset (snaking), re-bond, wire sag (horizontal), bridged wire, extra tail, wire sag (vertical), wire loop height, cross-wire spacing
Detectable Die Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Die chipping, die rotation, die missing, die crack, ink spot, die offset, scratch, foreign material contamination, epoxy coverage, die tilt
Substrate Size	50~300 mm (L) × 50~300 mm (W) × 0.1~30 mm (H)
Equipment Dimensions	1400 × 1550 × 1750 mm
Weight	1500 kg ± 5%
Power Rating	2.5 kW

Inspection Items

Wire Breakage	Missing Bond	Scratches	Misalignment / Angular Deviation
Wire Bundling	Bond Pad Misalignment	Cracking	Silver Glue/Epoxy Overflow
Wire Collapse	Abnormal Ball Diameter	Oxidation	Chipping
Abnormal Wire Arc	Chip Appearance Defects	Contamination	Missing Chip

Product Details