Die Bonder Manufacturer | OEM Customized Die Attach Machine

The Die Bonder is a critical assembly equipment for semiconductor chip packaging, used to precisely place and attach the die onto lead frames, PCBs, substrates or packaging materials.

The equipment range includes

• Automatic die bonders

• Manual die bonders

• Epoxy die bonders

• Eutectic die bonders

• Flip chip die bonders

• High-precision die attach systems.

Our die bonding machine are widely used in IC packaging, LED manufacturing, MEMS devices, photonics, RF modules, power semiconductors, Microwave module and advanced packaging applications.

Fully Automatic Die Bonder for Semiconductor Packaging
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
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