Die Bonder

HY-LD512H Die Bonding Machine is  Linear Die Bonder a high-performance linear die bonder designed specifically for advanced IC packaging applications. Engineered to meet the rigorous demands of modern semiconductor manufacturing.

HY-LD512 Die Bonder equipment is a fully automatic die bonder specially designed for IC die bonding and packaging.

HY-MD660M Die Attach Machine primarily applied to die bonding for chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields. 

HY-MD660 Die Bonding machine primarily used for die attach of chips and electronic devices in automotive electronics, aerospace, LiDAR, RF, TR components, consumer electronics and other fields, compatible with various die/device feed formats, and supports fully automatic placement.

HY-OE3200 Die Bonding machine  is designed for eutectic bonding of power devices, LEDs, optical communication components such as LD, PD/TIA, etc., supporting a wide range of chip/device formats with fully automatic placement.

HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications. 

HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications. 

HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications. 

HY-ED003  Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications. 

HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications. 

HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications. 

HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.