wafer polishing equipment

HY-SP855 single-side copper polisher handles precision lapping and polishing for semiconductor hard brittle materials. It adopts PLC touch control and built-in disc conditioner, featuring variable frequency drive, closed-loop pressure control and plate water cooling. The conditioned plate flatness reaches 0.01mm, delivering stable, uniform processing for high-precision substrate mass production.

The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.