bond strength tester

HY-PT8100 Bond Tester is a multi-function manual push-pull force tester designed for comprehensive mechanical testing in semiconductor and electronic packaging applications.

HY-PT6000 Wire Bond Pull Tester is designed for dynamic mechanical testing in semiconductor packaging, LED, SMT, BGA, automotive electronics, and sensor manufacturing. It supports pull, shear, and pull-out testing of bonding wires, solder balls, chips, ribbons, and pins, providing reliable evaluation of bonding strength and process quality.