COB COC Eutectic Bonding Machine

HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.

HY-GD800 is suitable for COB/COC multi-chip packaging processes and supports both dispensing die attach and thermal eutectic bonding. Fitted with a dual-drive gantry structure and high-precision CCD visual positioning system, its bonding head automatically switches between nozzles and dispensing tips to handle all types of chips. It accommodates standard 2-inch & 4-inch die trays, as well as 6-inch & 8-inch wafers with automatic wafer loading and unloading. An optional substrate conveyor track can be connected to external equipment to build automatic production lines. Bonding programs support custom editing to fit all customized production requirements.