Fully Automatic Multi-Functional Die Bonder for COB and COC Multi-Chip Eutectic Packaging

Product Introduction

The HY-GD800 Fully Automatic Multi-Functional Die Bonder is designed for multi-chip mounting and eutectic packaging in COB/COC processes, supporting two bonding methods: dispensing die attach and thermal eutectic bonding. Equipped with a dual-drive gantry and high-precision CCD visual positioning system, its bonding head can automatically switch between suction nozzles and dispensing tips. Compatible with 2/4-inch die trays as well as 6/8-inch wafers with automatic wafer loading and unloading, it can be connected to automated production lines via an optional conveyor track, and all bonding recipes are fully editable for customized production.

It has four core modules: a stable dual-drive gantry with 560×560mm XY travel and ±0.5μm repeatability, an all-in-one bonding head with dual CCDs, force control, dispensing and UV monitoring, a configurable material handling platform, and universal carriers with dual-side automatic loading systems for unmanned operation. A total of 12 standard components are equipped to guarantee high-precision packaging performance.

Component List

Product Features

1. Designed for high-precision multi-chip die attach and eutectic packaging processes

2. Suitable for bonding substrates and chips via dispensing die attach or thermal eutectic bonding in COB/COC manufacturing

3. Equipped with dual linear motor gantry and high-precision CCD vision positioning system to guarantee outstanding mounting accuracy

4. The bonding head automatically switches between suction nozzles and dispensing tips to handle various types of chips

5. Compatible with standard 2-inch & 4-inch die trays, 6-inch & 8-inch wafers; automatic wafer loading & unloading supported

6. Optional substrate conveyor track available to connect with external machines for inline mass production

7. Users can independently customize bonding recipes, visual positioning parameters and mounting sequences freely

Main Functional Modules

 

Module Name	Description
1. Dual-Drive Gantry System	Adopts dual linear motor driven gantry with 560×560mm XY travel for wide span and long stroke. Equipped with integrated cast iron base, it delivers stable operation and high positioning repeatability of ±0.5μm.
2. Bonding Head Assembly	Z-axis driven by precision lead screw and servo motor. Dual CCD vision recognizes chips as tiny as 0.1×0.1mm. ZR force control module auto-changes nozzles with adjustable bonding force of 20–500g. Integrated with dispensing, dual height measurement, UV curing and real-time CCD monitoring systems.
3. Material Handling Platform	Standard configuration includes bottom-view CCD, calibration stage, nozzle storage and force calibrator. Optional attachments: inline conveyor, wafer magazine, constant-temperature eutectic stage and auto loading/unloading unit for flexible feeding and production line integration.
4. Material Carriers	Compatible with standard 2/4-inch die trays, substrate carriers, 6-inch & 8-inch wafers to support production with various chip sizes.
5. Auto Loading & Unloading System	Load and unload units with cage-type trays can be installed on both sides of the machine. Fully automatic cyclic feeding & collecting enables unattended continuous production.