Eutectic Die Bonding Machine

HY-GD4000 handles both eutectic bonding and adhesive die attach for chip packaging. Equipped with dual bond heads and dual eutectic stages, it delivers high productivity with a 12-station automatic nozzle library. The independent ZR axis ensures precise component placement and consistent bonding pressure, while programmable multi-stage heating adapts to various eutectic alloys for multi-chip and flip-chip assembly. Its integrated vision system realizes automatic high-precision positioning and post-bond quality inspection.

HY-GD800 is suitable for COB/COC multi-chip packaging processes and supports both dispensing die attach and thermal eutectic bonding. Fitted with a dual-drive gantry structure and high-precision CCD visual positioning system, its bonding head automatically switches between nozzles and dispensing tips to handle all types of chips. It accommodates standard 2-inch & 4-inch die trays, as well as 6-inch & 8-inch wafers with automatic wafer loading and unloading. An optional substrate conveyor track can be connected to external equipment to build automatic production lines. Bonding programs support custom editing to fit all customized production requirements.

HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.