gold ball bonding

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-GB2012 Gold Ball Wire Bonder is mainly used for internal lead bonding of high-power LEDs, laser diodes, small and medium power diodes, transistors, integrated circuits, sensors, and special semiconductor devices. It is especially suitable for wire bonding of high-power LED devices.