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HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.
Brand :
HYRNUSItem No. :
HY-WB250M / HY-WB250PMOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaManual Wire Bonder Ball Wedge Bonding Machine
Product Introduction
HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is a key packaging machine for internal chip-to-pin interconnection in special electronic components. It is widely used in hybrid circuits, COB modules, MCMs, MEMS devices, RF and microwave modules, optoelectronic devices, military electronics and automotive electronic modules.
The machine is suitable for products with dimensions below 200 mm. By replacing bonding tools of different lengths, it can accommodate cavity depths from 12 mm to 15 mm or 21 mm. It also supports zero-tail stud bumping, while its stable ultrasonic energy output and integrated electrical control system help ensure consistent bonding quality and reliable operation.
Applications
Features
| No. | Feature |
| 1 | Suitable for Deep-Cavity and Large-Module Devices |
| 2 | Adaptable to devices with different cavity depths (ranging from 12 mm to 15 mm/21mm) by replacing capillary models of different lengths |
| 3 | Capable of zero wire tail bumping (stud bumping) function |
| 4 | Unique Zero-Tail Ball Placement Process Design |
| 5 | Integrated electrical control system |
Main Technical Specifications
| NO | Section | Parameter | Specification | Other Parameters | |
| 1. | Bond Head | Z Travel | 18 mm | Spool Size | 1/2 inch |
| 2. | X-Y Range | X: 15 mm, Y: 15 mm | |||
| 3. | Lift Table | Z Travel | 0~18 mm | Heater Temperature | Room temperature ~ 200°C |
| 4. | X-Y Range | 250 mm × 270 mm | Operation Menu | 7" TFT touch screen, Chinese menu | |
| 5. | Ultrasonic Power | Digitally controlled, 1000x subdivision | Power Supply | 220V ± 10% @ 50/60Hz, ≤500W | |
| 6. | Bonding Force | 1~250 g | Footprint (W×D×H) | ≤620 × 640 × 450 mm | |
| 7. | Wire Types |
HY-WB250M : Gold wire 15~75 μm, Platinum wire 18~25 μm, Silver wire 18~50 μm,Aluminum wire 18~100 μm HY-WB250PM : Gold wire 15~75 μm, Platinum wire 18~25 μm, Silver wire 18~50 μm,Aluminum wire 18~100 μm，Gold ribbon 12.7×50 ~ 25.4×300 μm |
Weight | Gross: approx. 70 kg; Net: approx. 45 kg | |
| 8. | Standard Configuration | Main unit, 1/2 inch spool, LED lighting, stereo microscope, workholder, 90° wire feeder | |||
Terms of use
| No | Item | Requirements |
| 1. | Parameter | Specification |
| 2. | Ambient Temperature (Room Temperature) | 15°C ~ 30°C |
| 3. | Ambient Relative Humidity | 30% ~ 60% (no condensation) |
| 4. | Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 5. | Power Requirements | 1. 220V ± 10% 2. Power ≤ 500W 3. Frequency: 50/60Hz |
| 6. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 7. | Voltage | 220V ± 10% |
| 8. | Frequency | 50/60Hz |
| 9. | Grounding | Must be grounded |
| 10. | Power | ≤ 500W |
| 11. | Interface Specification | 5A, Single-phase 3-wire |
Product Details
FAQs
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