Gold Wire Bonder Ball Bonding Machine

HY-GB2012 Gold Ball Wire Bonder is mainly used for internal lead bonding of high-power LEDs, laser diodes, small and medium power diodes, transistors, integrated circuits, sensors, and special semiconductor devices. It is especially suitable for wire bonding of high-power LED devices.

Brand :
HYRNUS
Item No. :
HY-GB2012
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

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Gold Wire Bonder Ball Bonding Machine

Product Introduction

HY-GB2012 gold wire bonding machine uses ultrasonic bonding technology to connect gold wire with chip pads and substrates, enabling reliable electrical interconnection and signal transmission. The gold wire end is formed into a ball by high-voltage electronic ball formation, then bonded under controlled pressure, time, and ultrasonic vibration. It is one of the key equipment used in electronic micro-assembly, offering stable bonding quality, good electrical performance, and higher reliability than silicon-aluminum wire bonding.

Product Features

*Supports single-direction and bi-directional bonding for flexible operation.

*Stores two-wire bonding data to improve convenience and efficiency.

*Separately adjustable loop height and second bond height for different bracket structures.

*Multiple loop shape options, suitable for high-power LED, deep-cup, and piranha LED brackets.

*Second bond ball compensation improves bondability and reduces failure rate.

*1-step or 2-step automatic indexing improves production efficiency.

*Continuous indexing function is suitable for rework applications.

*Capillary detection reduces false bonding caused by incorrect installation.

*Four-channel ultrasonic power output ensures more consistent bonding quality.

*Improved ball formation enables smaller first bonds and more reliable second bonds.

Application Fields

*Microwave devices

*RF modules

*Hybrid circuits

*MEMS circuits

*Optoelectronic devices

*Sensors

*Nano devices

*Semiconductor devices

*Radar devices

*Military components

*Special-purpose circuits

*COB/SOB packaging

Applicable Industries

*Optoelectronic companies

*Discrete electronic component manufacturers

*Research institutes

*University laboratories

*R&D and production organizations

Technical Parameters

Item	Specification
Power Supply	220 VAC ±10%, 50 Hz, 300 W, reliable grounding required
Optional Power Supply	AC 110 V customizable
Power Consumption	Max. 300 W
Applicable Gold Wire Diameter	16–50 μm / 0.7–2 mil
Bonding Temperature	Room temperature to 400°C
Ultrasonic Power	4 channels, 0–5 W, continuously adjustable in two ranges
Ultrasonic Time	5–200 ms ±5% / 20 ms per step
Bonding Time	2 channels, 0–200 ms
Bonding Pressure	2 channels, 25–180 g
Minimum Bonding Time	0.4 s / wire
Max. Automatic Span from First Bond to Second Bond	≥4 mm in both directions
Loop Height Adjustment Range	0–6 mm
Tail Wire Length	0–2 mm
Gold Ball Size	Negative electronic ball formation, adjustable diameter
Fixture Movement Range	Φ25 mm
Microscope	Standard two-step microscope: 15× / 30×
Optional Configuration	HD camera and monitor
Overall Dimensions	520 × 460 × 550 mm, L × W × H
Weight	Approx. 28 kg

Optional HD Camera and Monitor Specifications

Embedded system with FPGA + ARM architecture, running Linux 3.10 operating system.
Dual-core Cortex-A9 processor, 1 GHz main frequency, with up to 1 GB DDR3 memory.
Equipped with a 1/2-inch back-illuminated CMOS sensor.
High-speed image acquisition up to 2 MP, with 1920 × 1080 @ 60 fps resolution.
Two USB ports for connecting a wireless mouse or keyboard.
HDMI HD interface ensures clear and bright image display.
New user interface for more intuitive and convenient operation.
Popular flat button design, attractive and easy to use.
Advanced highlight suppression function effectively reduces strong reflection.
Supports Simplified Chinese, Traditional Chinese, and English language selection.
Monitor size: 24 inches.