MGP Encapsulation Mold

HY-PM252-6R professional MGP plastic sealing mold is custom-made for TO252-6R lead frame encapsulation. Featuring 6 mold boxes that process 12 lead frames per molding cycle, it fits all 550T and above plastic sealing presses. Constructed from DC53, ASP23 and tungsten steel with chrome-plated cavities, it is equipped with multi-zone temperature control and a quick-change structure. It delivers stable performance for mass IC packaging production and comes with fully interchangeable spare parts.

HY-PM220 is a TO220 MGP encapsulation mold featuring 320 cavities and 4 interchangeable mold cassettes, compatible with 450-ton and above molding presses. It adopts hard chrome plated cavities to maintain stable performance up to 100,000 shots, offering high-precision molding for semiconductor power device packaging with complete supporting spare parts.