What Are You Looking For?
HY-PM252-6R professional MGP plastic sealing mold is custom-made for TO252-6R lead frame encapsulation. Featuring 6 mold boxes that process 12 lead frames per molding cycle, it fits all 550T and above plastic sealing presses. Constructed from DC53, ASP23 and tungsten steel with chrome-plated cavities, it is equipped with multi-zone temperature control and a quick-change structure. It delivers stable performance for mass IC packaging production and comes with fully interchangeable spare parts.
Brand :
HYRNUSItem No. :
HY-PM252-6ROrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Precision Semiconductor TO252-6R Packaging MGP Mold
Product Introduction
HY-PM252-6R High Precision Semiconductor TO252-6R Packaging MGP Mold is independently developed for TO252-6R semiconductor lead frame packaging. It adopts a 6-mold-box layout; each mold box holds 2 lead frames, enabling 12 lead frames to be encapsulated in a single molding cycle. Compatible with all 550-ton and higher plastic sealing molding machines, its quick-disassembly mold box design supports full interchange of all internal inserts, drastically cutting mold replacement time and lifting overall production efficiency for semiconductor packaging factories.
Product Application
This High Precision Semiconductor TO252-6R Packaging MGP Mold is specially applied to mass encapsulation production of TO252-6R power semiconductor devices. It matches all 550T and above plastic sealing presses, widely used in IC packaging factories, semiconductor assembly workshops and electronic component manufacturing plants. The mold is suitable for batch packaging of power chips, switching transistors and other TO252-6R packaged semiconductors, supporting stable long-term mass production to meet the high-volume manufacturing demands of electronics, automotive electronics, new energy and industrial control industries.
Quality Control & Acceptance Standard of MGP Molding Die
We apply dual inspection standards for our High Precision Semiconductor TO252-6R Packaging MGP Mold: initial acceptance standard for brand-new molds, and long-term production standard for molds after 100,000 molding shots or 1 year of service. All dimensions are measured in mm unless marked otherwise.
| Inspection Item | Initial Acceptance Standard | Standard for 100,000 Shots / 1-Year Service |
| Plastic body & lead frame center offset (X/Y axis) | ≤0.05 | - |
| Flash on pins | No solid flash; transparent flash ≤1.0mm | - |
| Bubbles & pinholes on molded surface | <0.1 | - |
| Surface defects (scratch, ripple, crack, chipping) | None | - |
| Void above chip bonding & welding area | None | - |
| Runner vent / gate residual waste | Will not block post-process automatic transmission | Will not block post-process automatic transmission |
| Raised waste at gate border after separation | None | None |
| Center material cake overflow thickness & width | ≥0.05 | <0.05, width <2 |
| Runner side overflow thickness & width | ≥0.05 | <0.05, width <1 |
| Vertical thin flash on insert joint surface | ≥0.05 | ≤0.05 |
| Demolding performance | Smooth ejection, no broken runner/cull | Smooth ejection, no broken runner/cull |
| Frame deformation & locating hole tearing after demolding | Not allowed | Not allowed |
MGP Molding Die Configuration & Technical Specifications
Our High Precision Semiconductor TO252-6R Packaging MGP Mold comes with full standardized industrial configurations, including premium mold materials, bottom-up injection structure, multi-zone temperature control system, complete thermal insulation components and universal press matching design. All mechanical structures support rapid mold box replacement and long stable mass production, fully compatible with mainstream 550-ton and above plastic sealing molding machines.
| Item | Standard |
| Mold Main Body | Compatible with 550T and above plastic sealing presses of buyer; universal mold frame for 6 mold boxes with quick mold box replacement design |
| 1. Injection Structure | Bottom-up multi-barrel injection design; injection movement driven by built-in high-temperature leak-proof hydraulic cylinder with balancer, executed by injection head drive plate |
| 2. Full Interchangeable Mold Boxes | All mold boxes are 100% interchangeable on the mold frame, no position identification required |
| 3. Interchangeable Internal Components | All spare parts & inserts inside each mold box are fully interchangeable |
| 4. Quick Change Mold Box Mechanism | Mold box built-in ejector pin plate mechanical structure, connected with ejector drive unit inside mold frame; slide rail drawing & fitting design to realize fast mold box replacement |
| 5. Mold Material Standard | Mold box: DC53 (HRC59~60) |
| Cavity & inserts: ASP23 (HRC61~63) | |
| Center block: ASP23 (HRC61~63) | |
| Injection cylinder: ASP23 | |
| Injection head: Tungsten steel | |
| 6. Lead Frame Loading Rack | Made of high-strength aluminum alloy, lightweight & anti-deformation; floating support design ensures smooth feeding without jamming |
| 7. Cavity Surface Roughness | Comply with dimensional drawing requirements of TO252-6R packaged products |
| 8. Thermocouple Holes Layout | Thermocouple holes beside each heating rod hole on upper & lower mold plates, supporting independent temperature control for 24 heating rods; 4 thermocouple ports on rear side of both upper/lower mold frame, compatible with 2-zone / 4-zone temperature control presses |
| 9. Overheat Protection Port | Overheat cut-off sensor hole reserved on upper & lower mold frame, matching press overheat protection switch |
| 10. Air Cushion Base Plate | Air cushion function integrated into lower mold base plate for easy mold installation |
| 11. Fixing Plate Design | L-shaped pressing plate for upper & lower mold frame, compatible with platforms of different plastic sealing presses |
| 12. Fastener Standard | All screws & nuts adopt metric standard |
| 13. Injection Head Connection | Quick slide rail drawing, fitting & locking design for connector base and injection head drive plate |
| 14. Heating Rod Power | Temperature difference between upper and lower mold surface controlled within ±5℃ |
| 15. Heating Tube Marking | Rated power mark printed at root of each heating tube; fixing fixture installed around every heating hole |
| 16. Thermal Insulation Cover & Plate | Fixed thermal insulation cover for upper mold; quick-detachable thermal insulation plates on both sides of lower mold |
| 17. Thermal Insulation Plate Performance | All insulation plates resist long-term clamping impact without deformation, no surface defects on mold |
| 18. Heating Rod Spec | Marked with rated power & working voltage |
| 19. Thermocouple Interface | Matches buyer’s plastic sealing press, supports 2-point / 4-point / 24-point temperature control |
| 20. Overheat Protection Interface | Compatible with buyer’s plastic sealing press |
| 21. Press Plate Structure | Matches buyer’s plastic sealing press |
| 22. Upper & Lower Mold Plate Thickness | Plate thickness ≥40mm |
| 23. Press Plate Fastening Mode | Press plate tightly fastened on mold plate |
| 24. Press Plate Screws | Matches buyer’s plastic sealing press |
| 25. Ejector Pin Layout | Ejector pin position customized according to mold structure |
| 26. Press Platform Size | Provided by buyer |
| 27. Air Float Interface | Matches air pipe connector of molding press |
| 28. Oil Pipe Interface | Matches oil pipe connector of molding press |
| 29. Cavity Layout Drawing | Refer to TO252-6R plastic packaging product drawing |
| 30. Total Mold Thickness | Total thickness after mold closing exceeds 520mm, designed per standard specification |
Product Details
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