MGP Molding Die

 HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.

HY-PM23 MGP plastic molding die is customized for SOT23-20R semiconductor packaging. It is equipped with 6 mold boxes; each mold box holds 2 lead frames, with a total of 12 lead frames per full mold. All mold boxes and internal components are fully interchangeable and feature a quick disassembly and replacement structure.