What Are You Looking For?
HY-PM23 MGP plastic molding die is customized for SOT23-20R semiconductor packaging. It is equipped with 6 mold boxes; each mold box holds 2 lead frames, with a total of 12 lead frames per full mold. All mold boxes and internal components are fully interchangeable and feature a quick disassembly and replacement structure.
Brand :
HYRNUSItem No. :
HY-PM23Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaMGP Plastic Molding Die for SOT23-20R Semiconductor Packaging
Product Introduction
HY-PM23 MGP Plastic Molding Die is a supporting mold for automatic lead frame and molding compound pellet arranging integrated machine, specially designed for SOT23-20R reel lead frame epoxy encapsulation.
This mold features symmetric double-row layout with 6 independent mold boxes. It can carry 12 lead frames in one molding cycle to improve mass production efficiency for semiconductor packaging lines.
Mold boxes are made of DC53 steel and cavity inserts adopt ASP23 high toughness steel, with hard chrome plating on cavity surface for long service life. The quick swap mold box design reduces machine downtime, and it fits most mainstream 450T MGP molding presses stably. Custom mold layout service is available for different lead frame sizes.
Product Application
1. Mass epoxy encapsulation of SOT23-20R reel lead frames for diodes, transistors and small signal ICs
2. Compatible with 450T automatic MGP molding equipment with automatic lead frame and molding compound pellet feeding system
3. Applied to semiconductor packaging & test factories and electronic component mass production lines
4. Manufacture discrete chips for consumer electronics, IoT devices and automotive control circuits
Schematic Layout
Quality Control & Acceptance Standard of MGP Molding Die
Note: All dimensions are in mm unless marked separately.
1. Molding Process Parameters
| Item | Factory Acceptance Standard |
| Mold Temperature | 160~190℃ |
| Injection Pressure | 1000~1600 psi |
| Molding Cycle Time | 8~25 s |
2. Dimensional & Flash Tolerance
| Inspection Item | Factory Acceptance Standard | Standard after 100,000 shots / 1 year |
| X/Y offset of molding compound body | ≤0.05 | - |
| Offset between compound center & lead frame center | ≤0.05 | - |
| Vertical thin flash thickness & height of insert joint surface | ≤0.05 | ≤0.05 |
| Flash thickness & width of central residual cull | ≤0.05 | Thickness ＜0.05, Width ＜2 |
| Flash thickness & width on both sides of runner | ≤0.05 | Thickness ＜0.05, Width ＜1 |
3. Surface Defect Control Standard
| Defect Type | Acceptance Requirement |
| Cavity scratches & ripple marks | None |
| Surface bubbles & pinholes on molding compound | Diameter ＜0.1 |
| Cracks & chipping on molding compound | None |
| Smoke-shaped flash protrusion on ejector pin top | None |
4. Lead Frame & Flash Specification
| Inspection Item | Factory Acceptance Standard | Standard after 100,000 shots / 1 year |
| Flash on runner, vent slot and feed port | Residue shall not affect automatic post-transmission; No raised waste at feed port edge | Residue shall not affect automatic post-transmission |
| Flash on component pins | No black flash (gate area excluded) | No black flash on pins |
| Lead frame after mold opening & demolding | No deformation or positioning hole cracking | No deformation or positioning hole cracking |
5. Internal Void & Incomplete Filling Standard
| Inspection Item | Acceptance Requirement |
| Voids & delamination above chips, bonding pads and die islands | None |
| Voids in other molding compound areas | ≤0.01mm |
| Incomplete filling defects | Not allowed |
6. Demolding Performance & Cavity Hard Chrome Coating Life
| Inspection Item | Factory Acceptance Standard | Standard after 100,000 shots / 1 year |
| Demolding Performance | Smooth demolding; runner & cull without breakage | Smooth demolding; runner & cull without breakage |
| Hard Chrome Coating Service Life | Green molding compound ≥250,000 shots; Standard molding compound ≥300,000 shots, no coating peeling | Free of easily damaged inserts |
MGP Molding Die Configuration & Technical Specifications
| Inspection Item | Technical Standard |
| Compatible Equipment | Fits customer’s 450-ton molding press |
| Mold Base Frame | Universal frame for 6 mold inserts, quick mold insert replacement design |
| Injection System | Bottom-up multi-barrel injection; driven by 2 built-in high-temperature leak-proof hydraulic cylinders with balancer injection drive plate |
| Interchangeability of Mold Inserts | 100% interchangeable all mold inserts, no fixed position limit required |
| Internal Component Interchangeability | All spare parts & inserts inside mold inserts are mutually replaceable |
| Mold Insert Mechanism | Built-in ejector pin plate structure, slide rail design for fast disassembly & replacement |
| Core Mold Material & Hardness | 1. Mold insert: DC53 (HRC59~60) |
| 2. Cavity & inserts: ASP23 (HRC61~63) | |
| 3. Center block: ASP23 (HRC61~63) | |
| 4. Injection barrel: ASP23 | |
| 5. Injection tip: Tungsten steel | |
| Lead Frame Feeding Rack | High-strength floating aluminum alloy rack, lightweight & anti-deformation, smooth feeding without interference |
| Temperature Control System | 24 independent temperature control points; temp deviation between upper & lower mold ≤±5℃; 4 spare thermocouple ports for multi-zone press matching |
| Safety Protection | Built-in over-temperature cut-off sensor on upper & lower mold bases |
| Installation Auxiliary Design | Air-cushion lower base plate; L-shaped fixed pressing plate for multi-model press platforms |
| Insulation & Heat Preservation | Fixed upper insulation cover, quick-detachable lower insulation plates; high-strength thermal insulation plates resistant to long clamping impact |
| Standard Hardware & Interface | Metric screws & nuts; quick slide rail connector for injection drive plate; thermocouple & thermal protection ports matched with customer’s packaging presses |
| Mold Plate Thickness | Upper & lower mold plates thickness ≥40mm |
Product Details
HY-AU400 is an integrated machine serving as professional auxiliary equipment for IC plastic molding molds. It realizes automatic lead frame preheating and molding compound pellet arrangement. Fitted with robotic arms and multi-point temperature control, it adapts to all IC packaging varieties, reduces manual contamination, lifts production efficiency, and supports optional MES system networking.
HY-MF300 is auxiliary equipment for plastic packaging molds, capable of one-time removing runner and gate residual flash for all IC packages. Equipped with Mitsubishi/Yonghong PLC control and full safety interlocks including light curtain, door sensor, E-stop and two-hand buttons, it delivers stable performance and universal compatibility for all semiconductor packaging production lines.
HY-PM252-6R Molding is a high-precision molding mold designed for TO252-6R package products. The mold features a universal mold base capable of accommodating 6 mold boxes with quick mold box change design, utilizing a bottom-to-top multi-pot injection design driven by four built-in high-temperature-resistant, leak-proof hydraulic cylinders with a balanced injection head drive plate.
The HY-GD001/HY-GD803/HY-GD001A Automatic Degating Machine is designed for removing gates and runners from molded semiconductor leadframes. It combines precise punching, automatic air blowing and waste collection, while the mistake-proof mold and safety light curtain ensure reliable and safe operation.
HY-PS8120 Molding System is a fully automatic molding system designed for semiconductor packaging, supporting a wide range of package types including SOT, SOP, TOLL, TO, QFN, DFN, and BGA.
HY-LB200 Optoelectronic Drying Oven is designed for baking and drying electronic and hardware products at temperatures below 200°C. Equipped with PID temperature control, adjustable air circulation, timing settings, and multi-level over-temperature protection, it ensures stable and reliable operation. The stainless-steel chamber offers excellent durability and corrosion resistance, making the oven especially suitable for LED diodes, digital displays, backlights, and similar optoelectronic products.
HY-PS8180 Fully Automatic Semiconductor Molding System is designed for efficient encapsulation of ICs and power devices, ensuring stable quality and reliable protection.
leave a message
Scan To Wechat :
Scan To WhatsApp :
