Semiconductor Dicing Machine

HY-WD802 comes with dual imported high-speed spindles, coaxial & ring dual vision, built-in NCS height measurement, BBD detection and on-wheel dressing. Equipped with NSK transmission and Renishaw closed-loop linear scale for excellent positioning precision, it performs precision cutting on silicon, SiC, GaN and compound wafers for power device, IC and optoelectronic ceramic mass production.

HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.