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HY-WD802 comes with dual imported high-speed spindles, coaxial & ring dual vision, built-in NCS height measurement, BBD detection and on-wheel dressing. Equipped with NSK transmission and Renishaw closed-loop linear scale for excellent positioning precision, it performs precision cutting on silicon, SiC, GaN and compound wafers for power device, IC and optoelectronic ceramic mass production.
Brand :
HYRNUSItem No. :
HY-WD802Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China8-inch Dual Spindle Full-automatic Wafer Dicing Saw for Compound Semiconductor Die Separation
Product Introduction
HY-WD802 8-inch Dual Spindle Full-automatic Wafer Dicing Saw is equipped with dual imported high-speed spindles and a dual vision system with coaxial & ring illumination. It integrates a full range of automatic functions including NCS non-contact height measurement, real-time BBD broken blade detection and on-wheel blade dressing.
All three axes adopt NSK precision transmission parts with Renishaw linear scale closed-loop control for outstanding positioning accuracy.
Compatible with silicon, SiC, GaN and various special compound wafers, this machine delivers high-precision dicing for power devices, ICs and optoelectronic ceramics, supporting stable continuous automatic mass production.
Product Features
1. Body Structure & Operation
2. Intelligent Cutting Functions
3. High Efficiency Processing Performance
Product Application
This machine is suitable for processing silicon wafers, silicon carbide wafers, gallium nitride wafers, aluminum titanium carbide and other special compound wafers, and delivers precision dicing for power devices, integrated circuits (IC), memory chips, optical components, fiber-optic devices and electronic ceramics industries.
Technical Specifications
| No. | Item | Specifications | Remarks |
| 1 | Machining Size | Φ210 / Φ150mm | 8-inch / 6-inch wafer |
| 2 | Imported Spindle | Rotating Speed: 10000–60000 rpm | Dual spindles |
| Power: 1.8 KW | |||
| 3 | X-axis | Dicing Travel: Max 220mm | — |
| Driving Mode: Servo Motor | |||
| Resolution: 0.001mm | |||
| Dicing Speed: 0.1–1000mm/s | |||
| 4 | Y-axis | Dicing Travel: Max 220mm | — |
| Driving Mode: Servo Motor + Linear Scale Full Closed-loop | |||
| Repeat Positioning Accuracy: 0.002/5mm | |||
| Resolution: 0.0001mm | |||
| Cumulative Error: 0.003/220mm | |||
| Dicing Speed: 0.1–300mm/s | |||
| 5 | Z-axis | Effective Travel / Blade Hub Size: Max14.7mm / Φ58mm | Max cutting depth ≤4mm |
| Driving Mode: Servo Motor | |||
| Resolution: 0.0001mm | |||
| Repeat Positioning Accuracy: 0.001mm | |||
| Blade Hub Size: Φ47.4mm ~ Φ54mm | |||
| Max Blade Diameter: Φ58mm | |||
| Max Speed: 100mm/s | |||
| 6 | θ-axis | Rotation Range: Max 380° | — |
| Driving Mode: DD Direct Drive Motor | |||
| Repeat Positioning Accuracy: 3 arcsec | |||
| Resolution: 0.0002° | |||
| 7 | Alignment System | Illumination: Coaxial + Ring Light | — |
| Magnification: Low mag 0.75X, High mag 7.5X | |||
| Minimum Visible Feature: 0.0005mm | |||
| 8 | Machine Weight | 1200 kg ±5% | — |
| 9 | Machine Dimension | 1485mm × 1165mm × 1750mm (LWH) | — |
| 10 | Total Power Consumption | 8KW | — |
Functional Configuration
1. Height measuring loop detection and alarm function
2. Resume dicing from break point function
3. Blade hub dressing function
4. Pre-dicing planning function
5. Auto-focus function
6. Non-contact height sensing function (NCS)
7. On-wheel automatic blade dressing function
8. Blade wear detection function
9. Supports cutting of rectangular and circular workpieces
10. Auto dicing mode & semi-auto dicing mode
11. Unidirectional dicing mode & bidirectional dicing mode
12. Pause inspection available at any time during operation
13. Chinese operation interface, supports storage of multiple processing files
14. Full-process real-time micro error compensation
15. Low air pressure & low water pressure alarm protection
16. Process programming for complex workpiece cutting
17. Automatic image recognition function
Operating Environment
| Item | Specification |
| Ambient Temperature | The machine shall be installed in an environment around 23°C, preferably a constant-temperature clean room. |
| Power Supply | Single-phase 380V, 8KW |
| Compressed Air | Adopt compressed air with filtration efficiency ≥99.5% at 0.01μm. Equipped with refrigerated dryer for dehumidification. Air pressure: 0.6MPa–0.8MPa. Air consumption of spindle: 200L/min; Total machine air consumption: 400L/min. |
| Dicing Water | Water temperature controlled at room temperature ±2°C, pressure 0.2–0.4MPa. Tap water is acceptable. Waste water can be discharged directly after treatment. Water consumption: 5L/min. |
| Cooling Water (Spindle Cooling) | Circulating pure water supply via water chiller; water temperature controlled at room temperature ±2°C, pressure 0.2–0.4MPa. |
| Surroundings | Do not install the machine beside blowers, air vents, or equipment generating high temperature and oil mist. |
Product Details
HY-WD802 dicing saw is compatible with 6-inch/8-inch silicon, silicon carbide, gallium nitride and aluminum-titanium-carbon composite wafers for precision cutting of integrated circuits and power devices. Equipped with Renishaw Y-axis closed-loop grating scale and dual imported spindles running at 10,000–60,000 rpm, it reaches a maximum cutting speed of 100 mm/s. Supported by real-time micro error compensation, it enables high-precision Step cutting.
HY-WD802 wafer dicing saw integrates three core functions: NCS online height measurement, in-line blade dressing and BBD blade breakage detection. It also features automatic alignment, cut resumption after interruption and water/air pressure abnormality alarms to reduce blade chipping and wafer damage, ensuring stable yield for mass production.
HY-WD802 dicing saw must be installed in a 23°C temperature-controlled clean room with a 380V/8KW power supply and compressed air pressure of 0.6–0.8 MPa. The cutting water and spindle cooling water need constant temperature control.
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
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