High Precision Automatic 6 Inch Wafer Dicing Machine for Electronic Component Manufacturing

Product Introduction

HY-WD601 High Precision Automatic 6 Inch Wafer Dicing Machine is a compact fully automatic dicing solution for 6-inch semiconductor wafers and various hard brittle substrates. Integrated with an imported high-speed spindle and Y-axis full closed-loop grating control system, the equipment provides ultra-stable cutting accuracy and outstanding repeat positioning performance. Featuring dual coaxial and ring light vision, NCS non-contact height measurement and real-time BBD blade breakage detection, the machine effectively reduces chipping and improves processing yield. It supports versatile multi-material precision cutting for semiconductor packaging, optoelectronics and new energy applications. With intelligent touchscreen control, full safety interlock protection and flexible intelligent cutting modes, it ensures consistent and reliable mass production quality.

Product Features

Product Application

This equipment is capable of processing a wide range of workpieces, including silicon wafers, plastic encapsulated packages (QFN, BGA, etc.), PCBs, alumina and zirconia ceramic substrates, oxide ceramics for thermistors, varistors and photoresistors, glass, quartz, lithium niobate, lithium tantalate and magnetic materials.

It provides high-precision dicing solutions for multiple industries such as electronic components, integrated circuits (IC), LEDs, solar cells, optical devices, fiber-optic components and electronic ceramics.

Technical Specifications

 

No.	Item	Parameter	Remarks
1	Machining Size	Φ150 mm	6-inch Wafer
2	Imported Spindle	Rotation Speed: 10000–60000 rpm
		Power: 1.8 KW
3	X-axis	Dicing Travel: Max 220 mm
		Driving Type: Servo Motor
		Resolution: 0.001 mm
		Dicing Speed: 0.1–1000 mm/s
4	Y-axis	Dicing Travel: Max 160 mm
		Driving Type: Servo Motor + Linear Grating Full Closed-loop
		Repeat Positioning Accuracy: 0.002 mm / 5 mm
		Resolution: 0.0005 mm
		Cumulative Error: 0.003 mm / 220 mm
		Dicing Speed: 0.1–300 mm/s
5	Z-axis	Effective Travel / Chuck Size: Max 14.7 mm / Φ58 mm	Max Cutting Depth ≤4mm
6	θ-axis	Driving Type: Servo Motor
		Resolution: 0.001 mm
		Repeat Positioning Accuracy: 0.001 mm
		Chuck Size: Φ47.4 mm ~ Φ54 mm
		Blade Size: Max Φ58 mm
		Max Speed: 90 mm/s
		Rotation Range: Max 380°
		Driving Type: DD Direct Drive Motor
		Repeat Positioning Accuracy: 3 arcsec
		Resolution: 0.0002°
7	Alignment System	Illumination: Coaxial Light + Ring Light
		Magnification: 7.5X
		Minimum Observable Feature: 0.0005 mm
8	Machine Weight	500 kg ±5%
9	Machine Dimension	490 mm × 870 mm × 1670 mm (LWH)
10	Total Power Consumption	3 KW