Semiconductor Dicing Saw

HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.

HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.