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HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
Brand :
HYRNUSItem No. :
HY-WD1201Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China12-inch Single Spindle Semi-automatic Wafer Dicing Saw with Broken Blade Online Detection
Product Introduction
HY-WD1201 12-inch Single Spindle Semi-automatic Wafer Dicing Saw supports max workpiece size of Φ300mm and fits 8–12 inch frame workpieces, with 310mm X/Y cutting travel. It adopts a high-rigidity frame, vibration-damping Z-axis and high-speed X-axis structure. The X-axis feed speed is 0.1–1000mm/s, Y-axis full-stroke positioning accuracy ≤0.003mm, and θ-axis rotation reaches 380°. Equipped with a 10000–60000rpm high-speed spindle for blades up to Φ58mm.
Standard configuration includes online blade breakage detection, non-contact blade sensing and automatic sharpening. It adopts a 15-inch touch control system and supports GEM communication protocol. Powered by single-phase AC220V, the machine measures 1150*1020*1750mm and weighs approximately 1000KG. Suitable for precision dicing of 8–12 inch silicon wafers, silicon carbide, ceramics, optical glass and magnetic materials.
Excellent structural design1. High rigidity body ensures stable operation of the machine.
2. Specially designed Z-axis mechanism eliminates position offset caused by spindle vibration.
3. Special high rigidity design of the X-axis significantly improves rapid traverse speed, enhancing production efficiency.
4. Equipped with online blade grinding device to meet the blade sharpening needs during cutting of high-strength materials.
5. Fully servo-controlled handling mechanism ensures smooth handling, eliminating the possibility of shovel damage during handling.
6. Centralized lubrication system for easier maintenance, ensuring long-term precision of the machine.
Product Application
The equipment is applicable to 8–12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
Reliable and convenient operating system
1. 15-inch touch screen display shows more machine status information, with simple and smooth operation.
2. All fluids are controlled by software and stored in program groups, saving time for product changeover adjustments.
3. Self-developing motion control and image analysis algorithm improve system reliability and stability.
4. Semiconductor standard protocol facilitates integration with factory automation systems.
Technical Specifications
| Category | Item | Parameter |
| Model Info | Model | HY-PD1201 |
| Basic Workpiece | Maximum Size of Workpiece | Φ300 mm |
| X Axis | Dicing Range | 310 mm |
| Feed Speed Input Range | 0.1–1000 mm/s | |
| Y Axis | Dicing Range | 310 mm |
| Single Step Increment | 0.0001 mm | |
| Y Axis Positional Accuracy | Within 0.003 mm / 310 mm | |
| Z Axis | Maximum Valid Stroke | 14.7 mm (with Φ2" blade) |
| Movement Resolution | 0.00005 mm | |
| Repeat Accuracy | 0.001 mm | |
| Maximum Usable Blade Diameter | Φ58 mm | |
| θ Axis | Maximum Rotation Angle | 380° |
| Spindle | Operating Speed Range | 10000–60000 rpm |
| Maximum Power (kW) |
1.8 / 2.4 (at 60000 rpm) | |
| Torque (N·M) | 0.3 / 0.4 (15000–60000 rpm) | |
| Functional Features | Broken Blade Online Detection | Yes |
| Non-Contact Automatic Blade Presetting | Yes | |
| Automatic Sharpening | Yes | |
| GEM Communication Protocol | Yes | |
| Wafer Frame | Maximum Usable Frame Size | 8–12 inches |
| Other Specifications | Power Supply | Single-phase AC220V |
| Equipment Dimension (LWH) | 1150*1020*1750 mm | |
| Equipment Weight | ≈1000 KG |
Terms of Use
1. Clean compressed air with atmospheric dew point between -10℃ to -20℃, residual oil content of 0.1 ppm, and filtration rating of 0.01 μm/99.5% or higher.
2. Maintain the room temperature where the machinery is placed between 20℃ to 25℃ and control the fluctuation within ±1℃.
3. Control the temperature of the cutting water to be at room temperature +2℃, with fluctuations within ±1℃.
4. Control the temperature of the cooling water to be the same as room temperature, with fluctuations within ±1℃.
Product Details
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
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