What Are You Looking For?
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
Brand :
HYRNUSItem No. :
HY-PD801Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSingle Spindle Semi-automatic 8-inch Tape Dicing Saw for Package Singulation
Product Introduction
HY-PD801 is a Single-Spindle Semi-automatic 8-inch Tape Dicing Saw for semiconductor package singulation, with a maximum workpiece size of 210×210mm.
Built with a high-rigidity frame and optimized X-axis rapid traverse mechanism, it improves production efficiency by 5%. The optimized 20mm spindle spacing and standard square frames enable more workpieces to be loaded in one batch for mass production.
Fitted with a 15-inch touch screen, self-developed multi-piece cutting algorithm, non-contact automatic blade presetting and online broken blade detection, the machine maintains stable long-term precision and easy maintenance. It supports the GEM semiconductor communication protocol for seamless integration with factory automated production lines.
Excellent structural design
1. High rigidity body ensures stable operation of the machine.
2. Special high-rigidity design of the X-axis greatly improves the empty return speed, enhancing production efficiency by 5%.
3. Optimized spindle spacing to 20mm, effectively increases production efficiency.
4. Standard equipped square frame, accommodates more products compared to round trays.
5. Centralized lubrication system, easier long-term precision of the machine.
Product Application
Suitable for singulation of packaged semiconductors including DFN, QFN, BGA, ceramic substrates and mini LED boards.
Reliable and convenient operating system
1. 15-inch touch screen displays more machine status, with simple and smooth operation.
2. All fluids are controlled by software and stored in program group, saving product changeover adjustments.
3. Specialized software for multi-piece cutting paths 10% faster speed than conventional cutting methods.
4. Self-developed motion and image processing Algorithm improves system reliability and stability.
5. PRSM semiconductor standard communication protocol for easy integration with factory automation system.
Technical Specifications
| Category | Item | Specification |
| Workpiece Size | Maximum workpiece size | 210×210 mm (L×W) |
| X Axis | Dicing range | 220 mm |
| Feed speed range | 0.1–1000 mm/s | |
| Dicing range | 220 mm | |
| Y Axis | Single step | 0.001 mm |
| Positional accuracy | Within 0.005 mm/220 mm | |
| Maximum valid stroke | 25 mm (with ø2" blade) | |
| Z Axis | Movement resolution | 0.001 mm |
| Repeat accuracy | 0.003 mm | |
| Max blade diameter | ø60 mm | |
| θ Axis | Maximum rotation angle | 380° |
| Spindle | Operating speed range | 10000–60000 rpm |
| Max power(KW) | 1.8/2.4 at 60000 rpm | |
| Torque (N.M) | 0.3/0.4 (15000–60000 rpm) | |
| Standard Functions | Broken Blade Online Detection | Yes |
| Non-Contact Blade Presetting Sensor | Yes | |
| GEM communication protocol | Yes | |
| Frame | Maximum frame size | 210×210 mm (L×W) |
| Power Supply | Power input | Single-phase AC220V |
| Overall Dimension & Weight | Equipment dimension | 1020×890×1750 mm (LWH) |
| Equipment weight | ≈800 KG |
Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
