Semiconductor Encapsulation Mold

HY-PM252-6R professional MGP plastic sealing mold is custom-made for TO252-6R lead frame encapsulation. Featuring 6 mold boxes that process 12 lead frames per molding cycle, it fits all 550T and above plastic sealing presses. Constructed from DC53, ASP23 and tungsten steel with chrome-plated cavities, it is equipped with multi-zone temperature control and a quick-change structure. It delivers stable performance for mass IC packaging production and comes with fully interchangeable spare parts.

 HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.