Semiconductor Packaging Mold

HY-PM-TO252 Semiconductor Molding Mold is designed for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic components, optocouplers and sensors. It supports a wide range of package types and features a drawer-type quick-change mold box, balanced runner design and short-distance molding for high resin utilization, stable molding quality and easy maintenance.

HY-PM23 MGP plastic molding die is customized for SOT23-20R semiconductor packaging. It is equipped with 6 mold boxes; each mold box holds 2 lead frames, with a total of 12 lead frames per full mold. All mold boxes and internal components are fully interchangeable and feature a quick disassembly and replacement structure.