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HY-PM-TO252 Semiconductor Molding Mold is designed for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic components, optocouplers and sensors. It supports a wide range of package types and features a drawer-type quick-change mold box, balanced runner design and short-distance molding for high resin utilization, stable molding quality and easy maintenance.
Brand :
HYRNUSItem No. :
HY-PM-TO252Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaTO252 MGP Molding Mold for Semiconductor Devices
Product Introduction
HY-PM-TO252 Semiconductor Molding Mold is mainly used for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic devices, optocouplers and sensor components. It is suitable for various package types, including TO, DIP, SDIP, SOD, SOT, SOP, SSOP, TSSOP, QFN, QFP, LQFP, PLCC, IPM, ORPC, OC and BGA.
The mold box adopts a drawer-type quick-change structure, making mold replacement and maintenance more convenient. With a balanced runner design and short-distance molding process, it helps improve resin utilization, reduce material waste and ensure stable molding quality. The overall structure offers good processability, reliable performance and easy maintenance for semiconductor packaging production.
Specification
| No | Item |
| 1 | Supports different cavity designs according to various leadframe sizes to maximize output per shot. |
| 2 | Adopts bottom injection with multi-cylinder system, combined with internal rack-and-pinion and positioning sliders to drive multiple injection heads. |
| 3 | Vacuum function can be integrated as required. |
| 4 | Core-pulling mechanism for molding can be integrated as required. |
| 5 | Surface treatment of molded strips can be hard chrome plating or vacuum coating. |
Sample display
Product Details
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