Silicon Dicing Saw

HY-WD1202 adopts imported RPS spindles, NSK precision transmission parts and Renishaw encoders for Y-axis closed-loop control with high positioning accuracy. It supports NCS height measurement, BBD blade detection, auto image recognition and on-wheel dressing, suitable for silicon, SiC/GaN wafers, ceramics, PCBs and optical glass. Applied to precision dicing for IC, power device and LED industries, the touchscreen machine has full pressure and temperature alarm protection. It offers multiple cutting modes for regular and complex workpieces, fitting for mass production in constant-temperature clean rooms.

HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.