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Tape Dicing Saw

2 results found for "Tape Dicing Saw"
  • Semi-automatic Tape Dicing Saw
    8-inch Dual Spindle Semi-automatic Tape Dicing Saw for Package Singulation
    HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
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  • Wafer Saw
    Single-Spindle Semi-automatic 12-inch Tape Saw With NCS Non-contact Height Measurement for Package Singulation
    HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
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Contact us:allen@hyrnus.com