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HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
Brand :
HYRNUSItem No. :
HY-PD802Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China8-inch Dual Spindle Semi-automatic Tape Dicing Saw for Package Singulation
Product Introduction
HY-PD802 8-inch Dual Spindle Semi-automatic Tape Dicing Saw is a semi-automatic dual-spindle dicing saw for IC package singulation, supporting max 210×210mm workpiece frames. Rigid machine body ensures stable high-speed cutting; optimized X-axis structure speeds up idle return stroke to boost productivity. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen adopts optimized multi-path cutting algorithm, supporting batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-automatic packaging lines.
Excellent structural design
1. The rigid machine frame delivers steady performance during high-speed cutting.
2. The reinforced X-axis structure drastically speeds up idle return travel, lifting overall throughput by 5%.
3. Spindle separation is optimized with a 20mm gap to raise processing capacity efficiently.
4. A standard square workpiece tray comes fitted, holding more components than traditional circular trays.
5. Built-in centralized lubrication simplifies maintenance and preserves consistent long-term machining precision.
Product Application
Ideal for singulation of various packaged semiconductors, including DFN, QFN, BGA, ceramic substrates and mini LED boards.
Reliable and convenient operating system
1. A 15-inch touch operation panel displays comprehensive machine operating status data, delivering an easier and smoother operating experience.
2. All fluid parameters are software-controlled and stored in program groups, cutting down debugging time during product changeover.
3. Custom optimized software for multi-workpiece cutting paths delivers 10% higher processing speed than traditional cutting routines.
4. Self-developed low-level motion control and image processing algorithms enhance the overall system’s reliability and stability.
5. It supports SEMI industry-standard communication protocols for easy integration with factory automation systems.
Technical Specifications
| Category | Item | Specification |
| Model Info | Model | HY-PD802 |
| X Axis | Max workpiece size | 210×210 mm (L×W) |
| Dicing range | 220 mm | |
| Feed speed range | 0.1–1000 mm/s | |
| Y1, Y2 Axis | Dicing range | 220 mm |
| Single step increment | 0.001 mm | |
| Y-axis positioning accuracy | Within 0.005 mm / 220 mm | |
| Z1, Z2 Axis | Max valid stroke | 25 mm (with φ2″ blade) |
| Movement resolution | 0.001 mm | |
| Repeat accuracy | 0.003 mm | |
| Max blade diameter available | φ60 mm | |
| θ Axis | Max rotation angle | 380° |
| Spindle | Operating speed range | 10000–60000 rpm |
| Max power (KW) | 1.8/2.4 at 60000 rpm | |
| Torque (N·M) | 0.3/0.4 (15000–60000 rpm) | |
| Functions | Broken Blade Detection | Yes |
| Non-Contact Blade Presetting | Yes | |
| Communication | GEM communication protocol | Yes |
| Frame | Max frame size available | 210×210 mm (L×W) |
| Power | Power supply | 3-phase AC380V |
| Dimension | Equipment dimension | 1150×1100×1750 mm (L×W×H) |
| Weight | Equipment weight | ≈1200 KG |
Terms of Use
1. Clean compressed air with atmospheric dew point between -10℃ to -20℃, residual oil content of 0.1 ppm, and filtration rating of 0.01 μm/99.5% or higher.
2. Maintain the room temperature where the machinery is placed between 20℃ to 25℃ and control the fluctuation within ±1℃.
3. Control the temperature of the cutting water to be at room temperature +2℃, with fluctuations within ±1℃.
4. Control the temperature of the cooling water to be the same as room temperature, with fluctuations within ±1℃.
Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
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