trim form machine

This HY-TFC100 Semiconductor Trim and Form Machine is designed for lead trimming, forming and singulation after product encapsulation. Suitable for SOP and SSOP packages, it features PLC control, servo motor drive, continuous magazine loading, automatic tube unloading and multiple safety protections, ensuring stable and efficient post-molding processing.

HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.