This HY-TFC100 Semiconductor Trim and Form Machine is designed for lead trimming, forming and singulation after product encapsulation. Suitable for SOP and SSOP packages, it features PLC control, servo motor drive, continuous magazine loading, automatic tube unloading and multiple safety protections, ensuring stable and efficient post-molding processing.
Brand :
HYRNUSItem No. :
HY-TFC100Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
Chinaleave a message
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