wafer expanding machine

HY-WE2002M Manual Wafer Expander machine is designed for die expansion processes in LED, transistor, integrated circuit, and other semiconductor device production. It integrates heating, film stretching, wafer expansion, and film fixing into one process, with adjustable temperature, expansion time, and return speed for stable and efficient operation.

HY-WE1130 Semi-automatic Wafer Expander is designed for 6-inch dicing tape processing. It uses electric heating to soften the tape and achieve uniform, flat wafer expansion. Manual loading, automatic waste film cutting and collection, safety light curtain protection, and dual-button operation ensure efficient and safe production.