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HY-WE2002M Manual Wafer Expander machine is designed for die expansion processes in LED, transistor, integrated circuit, and other semiconductor device production. It integrates heating, film stretching, wafer expansion, and film fixing into one process, with adjustable temperature, expansion time, and return speed for stable and efficient operation.
Brand :
HYRNUSItem No. :
HY-WE2002MOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaManual Wafer Expander machine for IC power transistors
Product Introduction
HY-WE2002M Manual Wafer Expander machine is widely used for die expansion in the production of LEDs, medium- and low-power transistors, integrated circuits, and other special semiconductor devices. It adopts a dual-cylinder vertical control structure to ensure stable and consistent operation.
The machine integrates heating, film stretching, wafer expansion, and film fixing into a complete process. Its constant-temperature heating system enables uniform and controlled expansion around the dicing film, helping maintain consistent die spacing and expansion quality. Heating temperature, expansion time, and return speed can be adjusted according to different process requirements. With simple operation and high single-shift efficiency, the machine is suitable for semiconductor packaging and chip assembly applications.
Main Applications
Equipment Features
| No. | Details |
| 1 | Adopts dual-cylinder vertical control for stable operation |
| 2 | Constant-temperature design ensures uniform and moderate peripheral expansion of the film |
| 3 | Heating, stretching, wafer expansion, and film fixing are integrated into one complete process |
| 4 | Heating temperature, expansion time, and return speed are all fully adjustable |
| 5 | User-friendly operation with high single-shift production efficiency |
Technical Parameters
|
No. |
Parameter |
Specification |
|
1 |
Power Supply Voltage |
AC220V ±10%, 50Hz |
|
2 |
Rated Power |
500W |
|
3 |
Working Air Pressure |
4kg/cm², 1P or 1.5P |
|
4 |
Temperature Range |
Room temperature ~ 400℃ |
|
5 |
Upper Cylinder Stroke |
200 mm |
|
6 |
Lower Cylinder Stroke |
100 mm (adjustable and positionable) |
|
7 |
Heating Disc Diameter |
140 mm |
|
8 |
Overall Dimensions |
L 270 × W 220 × H 900 mm |
|
9 |
Machine Weight |
20 kg |
Operating Procedures
| No. | Details |
| 1 | Connect the power supply and attach the high-pressure air hose to the quick pneumatic connector. |
| 2 | Turn on the power switch and set the temperature to 75℃ (temperature may vary by ±5℃ for different wafer films). |
| 3 | Set the upper cylinder switch to the "UP" position to return the upper pressing mold to the top. Set the lower cylinder switch to the "DOWN" position to return the lower pressing mold to the bottom. Repeat the lower cylinder movement several times and adjust its ascending speed to as slow as possible. |
| 4 | Release the latch, lift the upper worktable, place the wafer expander inner ring on the lower mold, and put the wafer film at the center of the lower mold with the wafer facing upward. Cover with the upper pressing mold and fasten the latch. |
| 5 | Set the lower cylinder switch to the "UP" position. The lower mold rises slowly, expanding the film outward and gradually widening the die spacing. Stop ascending when the die spacing reaches about 2–3 times the original size. Place the wafer expander outer ring flat on the film and inner ring with its rounded edge facing downward. |
| 6 | Set the upper cylinder switch to the "DOWN" position. The upper pressing mold presses down to fix the expanded wafer film in place, then returns to the topmost position. |
| 7 | Set the lower cylinder switch to the "DOWN" position. The lower mold descends to the bottom, and the expanded wafer film is taken out. |
| 8 | Trim the excess film after wafer expansion, then send it to the next process for glue preparation and die bonding. |
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