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Semi-automatic Wafer Expander Wafer Film Expansion Machine for 6-inch Dicing Tape

HY-WE1130 Semi-automatic Wafer Expander is designed for 6-inch dicing tape processing. It uses electric heating to soften the tape and achieve uniform, flat wafer expansion. Manual loading, automatic waste film cutting and collection, safety light curtain protection, and dual-button operation ensure efficient and safe production.

  • Brand :

    HYRNUS
  • Item No. :

    HY-WE1130
  • Order(MOQ) :

    1 Set
  • Warranty :

    One-Year Warranty and Lifetime Maintenance
  • Payment :

    T/T
  • Lead Time :

    7-35 Days
  • Product Origin :

    China
  • Semi-automatic Wafer Expander Wafer Film Expansion Machine for 6-inch Dicing Tape

     

    Product Introduction

    HY-WE1130 Semi-automatic Wafer Expander is designed for the expansion of 6-inch dicing tape after wafer cutting. The operator manually loads the dicing tape and installs the wafer ring, while the electrically heated expansion system softens the tape and controls the wafer temperature to ensure uniform spacing and a flat expansion result.

    For improved operational safety, the machine is equipped with a full-coverage safety light curtain and a dual-button interlock start system. After expansion, the waste film is automatically cut and collected, simplifying operation and improving processing efficiency. It is suitable for semiconductor wafer, LED chip, and other precision chip packaging processes.

     

    Main Functions

    No.

    Details

    1

    Designed for processing 6-inch dicing tape expansion

    2

    Manual loading of dicing tape and mounting of the wafer ring

    3

    Equipped with fully effective safety light curtain protection

    4

    Dual-button interlock start function for enhanced operational safety

    5

    Electrically heated expansion process, which softens the dicing tape while controlling wafer temperature, resulting in uniform and flat expansion

    6

    Automatic waste film cutting and automatic waste film collection system

     

     

    Technical Specification

    Parameter Specification
    Name Semi-automatic Wafer Expander
    Model HY-WE1130
    Applicable Wafer Film 6-inch dicing tape / wafer film
    Operating Voltage AC220V
    Operating Air Pressure 0.5~0.7 MPa
    Dimensions (L×W×H) 560 × 820 × 1360 mm
    Power Supply 220V / 50Hz
    Power Rating 300W
    Weight 120 kg
    Operating Environment 10~35 , 35~85% RH

    Product Details

    wafer expanderwafer expander machine

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If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact us:allen@hyrnus.com