wafer grinding machine

HY-WT9330 is equipped with one air-bearing grinding spindle and two air-bearing workpiece spindles. It can process various ultra-hard, brittle and hard-to-grind substrates up to 12 inches, enabling high-efficiency, damage-free and ultra-precise mirror grinding with outstanding thickness accuracy, suitable for the back thinning process of all types of chip wafers.

HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.

The HY-ST3002 handles 4–12 inch wafers for precision thinning and grinding of hard brittle semiconductors. Fully upgraded with mature processes, it features enhanced accuracy and stable long-run performance, with refined automatic thinning architecture and premium key parts: hydrostatic air-bearing grinding spindle, hydrostatic air-bearing wafer holding spindle, high-rigidity large-diameter rotary table.