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HY-WT9330 is equipped with one air-bearing grinding spindle and two air-bearing workpiece spindles. It can process various ultra-hard, brittle and hard-to-grind substrates up to 12 inches, enabling high-efficiency, damage-free and ultra-precise mirror grinding with outstanding thickness accuracy, suitable for the back thinning process of all types of chip wafers.
Brand :
HYRNUSItem No. :
HY-WT9330Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-performance Wafer Thinning and Grinding Equipment for 12 Inch Hard Brittle Substrates
Product Introduction
HY-WT9330 High-performance Wafer Thinning and Grinding Equipment is equipped with one 9.5kW air-bearing grinding spindle and two air-bearing workpiece spindles, fitted with porous vacuum chuck tables for stable wafer holding. It supports hard brittle substrates with a maximum processing size of Ø300mm. Operators only need to manually load cassettes; multiple robotic arms automatically complete positioning, grinding, spin cleaning and drying to realize unattended mass production. The grinding Z-axis features 120mm travel and a minimum feed increment of 0.1μm to ensure precise thickness control. Post-grinding wafer TTV reaches 1μm, inter-wafer thickness deviation is ±2.5μm, and surface roughness Ra＜10nm, delivering excellent flatness and mirror finish for back thinning of all types of chip wafers.
Product Application
This equipment is designed for precision grinding of hard and brittle electronic materials and components. It supports multiple substrates including silicon, silicon carbide, compound semiconductors, epoxy resin, sapphire and ceramics, and is specially developed for hard-to-grind ultra-hard materials such as SiC, Lithium Tantalate (LT) and Lithium Niobate (LN) within 12 inches. It is widely applied to the back thinning of silicon wafers for integrated circuits, discrete semiconductor devices and LED chips.
Machine Structure Diagram
Machine Operation Process
| Step | Operation Description |
| 1 | Manually load the wafer cassette into the equipment. |
| 2 | The robotic arm takes the wafer out of the cassette and transfers it to the positioning stage for center alignment. |
| 3 | Arm T1 picks up the wafer from the positioning stage and places it on the chuck table. |
| 4 | Perform grinding processing. |
| 5 | Arm T2 adsorbs the wafer from the chuck table and moves it to the spin cleaning station for cleaning and drying. |
| 6 | The robotic arm retrieves the wafer from the spin cleaning station and puts it back into the cassette, and the above flow loops repeatedly. |
Specifications
| No. | Item | Parameter |
| 1 | Maximum Workpiece Size | Ø300 mm |
| 2 | Grinding Air-bearing Spindle | Quantity: 1 |
| Power: 9.5 kW | ||
| Speed: 800~4000 r/min | ||
| 3 | Workpiece Air-bearing Spindle | Quantity: 2 |
| Speed: 50~300 r/min | ||
| 4 | Grinding Z-axis | Travel: 120 mm |
| Grinding Feed Speed: 0.0001~0.08 mm/s | ||
| Minimum Feed Increment: 0.1μm | ||
| 5 | Clamping Method | Porous Vacuum Chuck |
| 6 | Post-grinding TTV | 1μm |
| 7 | Wafer-to-wafer Thickness Deviation After Processing | ±2.5μm |
| 8 | Post-grinding Surface Roughness | Ra＜10 nm |
| 9 | Overall Dimension | 3131*1000*1997 mm |
Main Frame
| No. | Item | Description |
| 1 | Frame | Lower Frame: 50×100 square tube welded support (Standard) |
| Upper Frame: 30×60 aluminum profile | ||
| 2 | Cover Plate | Cold rolled steel plate with plastic spraying surface (Standard) |
| 3 | Structural Parts | 45# steel with chrome-plated surface & aluminum alloy with anodized surface |
| 4 | Power Supply | Three-phase 380 V, 50 Hz |
| 5 | Air Source | ≥0.5 MPa, 400 L/min |
Product Details
HY-WT9530 is fitted with 2 air-bearing spindles and 3 vacuum chuck tables for hard brittle substrates up to 8-inch. Operators only need to load cassettes manually, while the machine completes full automatic cycles including rough/fine grinding, cleaning and recovery. Post-grinding TTV≤1.5μm with excellent flatness and surface roughness, suitable for backside thinning of various semiconductor wafers.
HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
HY-WT9230 is developed for ultra-hard brittle semiconductor materials up to 12 inches. Built with dual air-bearing spindles and a high-precision grinding Z-axis, it supports fully automatic mirror thinning with high efficiency and damage-free processing. Equipped with a porous vacuum chuck and ultra-fine feed control, the machine ensures superior flatness and thickness uniformity for semiconductor wafer thinning processes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
HY-WC615 double-side wafer chamfering machine is equipped with CCD vision positioning & online thickness measurement modules, self-developed core mechanical components and full auto loading/unloading system, delivering outstanding machining precision and user-friendly touch operation for wafer chamfer processing.
The HY-ST3005 handles 4–12 inch hard brittle semiconductor substrates for high-precision back thinning. Iteratively upgraded for superior accuracy and long-term stability, it features premium core assemblies (hydrostatic air-bearing grinding spindle, high-precision wafer spindle, high-rigidity large-diameter rotary table) and high automation for mass production of silicon and compound semiconductor wafers.
The HY-ST3002 handles 4–12 inch wafers for precision thinning and grinding of hard brittle semiconductors. Fully upgraded with mature processes, it features enhanced accuracy and stable long-run performance, with refined automatic thinning architecture and premium key parts: hydrostatic air-bearing grinding spindle, hydrostatic air-bearing wafer holding spindle, high-rigidity large-diameter rotary table.
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