Wafer Saw Machine

HY-WD681 provides micron-precision cutting for 6/8-inch wafers, ceramic and glass substrates. Built with auto CCD vision alignment and high-speed adjustable spindle, it saves cleanroom space while boosting production stability and throughput, ideal for semiconductor mid-process singulation & Mini LED manufacturing.

HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.