What Are You Looking For?
HY-WD681 provides micron-precision cutting for 6/8-inch wafers, ceramic and glass substrates. Built with auto CCD vision alignment and high-speed adjustable spindle, it saves cleanroom space while boosting production stability and throughput, ideal for semiconductor mid-process singulation & Mini LED manufacturing.
Brand :
HYRNUSItem No. :
HY-WD681Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China6 and 8-Inch Wafer Dicing Saw with Multi-substrate Compatibility for Semiconductor Processing
Product Introduction
HY-WD681 Wafer Dicing Saw provides stable micron-precision dicing cutting for 6/8-inch wafers, thin ceramic substrates, glass substrates and Mini LED light boards. Built with high-precision auto CCD vision alignment system, it supports auto correction, auto-focus and real-time blade breakage detection to reduce manual work and boost cutting consistency.
Equipped with a high-speed adjustable spindle ranging from 3,000 to 60,000 rpm, the machine supports variable cutting speed from 0.1 to 800 mm/s, delivering outstanding repeatability accuracy of 0.001 mm for long-run mass production.
Adopting a compact single-spindle layout, the machine takes only 0.45 ㎡ cleanroom space. It features an intuitive industrial touchscreen HMI for custom cutting program editing and real-time production monitoring, perfectly ideal for semiconductor mid-process wafer singulation and high-volume Mini LED manufacturing.
Product Features1. Compact footprint, occupying only 0.45 square meters of cleanroom space.
2. Equipped with high-precision CCD system to realize automatic positioning, correction recognition, auto-focus and cutting path inspection, greatly reducing labor costs.
3. HY-WD681 supports optional upgrade for 8-inch workpiece processing.
4. Compatible with 6-inch & optional 8-inch wafers, ceramic substrates, glass substrates, Mini LED boards and other microelectronic components.
5. The user-friendly editing software is easy to learn. The built-in HMI supports real-time production status monitoring, production plan configuration and production data review.
Product Application
The machine is designed for semiconductor mid-process singulation. It supports standard 6-inch wafers and optional 8-inch square wafers, and can process ceramic substrates, glass substrates, Mini LED light boards and other microelectronic components for precision cutting.
Compact Body, Superior Cutting Speed!
1. Compact Structure: This dicing saw features a compact layout. It delivers high-precision cutting performance while occupying minimal cleanroom space, saving floor area and boosting overall production efficiency.
2. High Precision: Adopting state-of-the-art precision cutting technology, it achieves micron-level cutting accuracy to satisfy strict product quality standards.
3. Fast Cutting Speed: Our 6-inch wafer dicing saw offers efficient cutting speed to match diverse production demands and shorten cycle times.
Technical Specifications
| Category | Item | Unit | HY-WD681 | |
| Workpiece | Workpiece Size | — | Φ6" | Φ8" (Option) |
| Square Die 8 inch Special Spec | ||||
| X-axis | Cutting Range | mm | 210 | |
| X-axis | Cutting Speed | mm/s | 0.1 ~ 800 | |
| Y-axis | Cutting Range | mm | 160 | 210 |
| Y-axis | Single Step Feed | mm | 0.0001 | |
| Y-axis | Index Positioning Accuracy | mm | 0.005/160 (Single error) 0.003/5 |
0.002/210 (Single error) 0.002/5 |
| Z-axis | Max. Stroke | mm | 32.2 (Φ2" blades) | |
| Z-axis | Moving Resolution | mm | 0.00002 | |
| Z-axis | Repeatability Accuracy | mm | 0.001 | |
| θ-axis | Max. Rotating Angle | deg | 320 | |
| θ-axis | Layout | — | Single spindle | |
| Spindle | Rated Output | kW | 2.0 at 40,000 min⁻¹ | 1.8 at 60,000 min⁻¹ |
| Spindle | Rated Torque | N·m | 0.48 | 0.29 |
| Spindle | Revolution Speed Range | min⁻¹ | 3,000 – 40,000 | 6,000 – 60,000 |
| Overall Dimension | Equipment Size (L×W×H) | mm | 650 × 950 × 1,670 (L × W × H) | |
| Weight | Equipment Weight | kg | ≈650 | |
Terms of Use
1. Adopt clean compressed air meeting the following requirements: atmospheric dew point from -20℃ to -10℃, residual oil content ≤0.1 ppm, and filtration efficiency ≥99.5% for particles of 0.01 μm.
2. Keep the ambient temperature of the machine installation room between 20℃ and 25℃, with temperature fluctuation limited to ±1℃.
3. Control cutting water temperature at room temperature +2℃, and keep its fluctuation within ±1℃.
4. Keep cooling water temperature consistent with ambient room temperature, with fluctuation controlled within ±1℃.
Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
