X Ray Electronic Components

HY-XRB8101 fast 3D CT X-Ray system adopts X-ray penetration to complete non-destructive Open Hole (OH) flaw inspection for laminated power cell corners. Multi-angle scanning generates complete 3D volumetric data, and built-in AI algorithms realize automatic defect judgment to stabilize quality control during mass new energy cell manufacturing.

HY-XR5010(2.5D) Series performs non-destructive testing for IC packaging, BGA/QFN chips, PCBA and capacitors. Equipped with CNC motion, multi-angle imaging and one-click void analysis, it detects voids, solder faults and dimensional errors. Three models fit small-batch checks, production sampling and lab R&D; optional barcode tracking and a high-res detector spot defects as tiny as 4μm. Full enclosed lead shielding limits radiation below 1μSv/h, with complete official radiation safety certifications.