Semi-Automatic X-Ray Inspection System for New Energy Batteries and Semiconductors

Product Functions & Working Principles

This equipment emits X-rays through an X-ray source, which penetrate the interior of the tested object. The receiver receives the X-rays and forms images, based on which personnel manually determine the internal defects of the tested object.

Product Features

1. CNC Programmable Motion

Pre-set motion paths support automatic multi-point inspection. It is mainly used for quality judgment of small-batch products and greatly improves inspection efficiency.

2. Automatic Bubble Measurement

One-click automatic measurement to calculate the area ratio of bubbles and voids inside products.

3. High-Definition Imaging

The original images are processed by algorithms for higher clarity, making product defects easier to identify.

4. Multi-Layer Safety Protection

The whole machine is enclosed by a lead cabin, with radiation leakage below the national standard of 1μSv/h. Interlock switches are installed on lead doors to automatically cut off X-ray emission once the door is opened. The equipment has passed radiation safety certification and obtained exemption certificates.

Technical Specifications 1

 

Module	Item	Details
Model		HY-XR5010A
X-Ray Source	Maximum Tube Voltage	90KV
	Maximum Tube Current	200μA
	Maximum Output Power	8W
	Minimum Focal Spot	7μm
	X-Ray Tube Service Life	8000h or 1 year from device delivery (whichever comes first; man-made damage excluded)
Imaging System	Spatial Resolution	5.8 lp/mm
	Pixel Size	85μm
	Frame Rate	35fps (1×1)
	Effective Flat Panel Detection Area	128×128mm
	Pixel Matrix	1536×1536
	Tilt Function	Optional ±45° Tilt
	Magnification	Geometric Magnification: 40X (31X for tilt version)System Magnification: 200X (155X for tilt version, unlimited magnification with open parameters)
	Flat Panel Service Life	8000h or 1 year from device delivery (whichever comes first; man-made damage excluded)
Stage	Maximum Loadable Sample Weight	10KG
	Stage Size	500mm × 500mm
	Effective Stage Detection Range	460mm × 460mm
	Product Fixture	Customized as required
Software System	Navigation & Positioning	Supported
	Automatic Measurement	Supported
	CNC Automatic Inspection	Supported
	Automatic Sleep	5 minutes of no operation on the X-ray tube (configurable)
	Motion Control Method	Mouse & Keyboard & Joystick
Industrial PC (IPC)	Monitor	23.8 Inch
	Operating System	Win10
	Hard Disk	1TB SSD
Others	Total Machine Weight	1400Kg
	Door Opening Method	Manual Left-opening Door
	X-Ray Leakage	≤1.0 μSV/h(Tested with a third-party certified radiation dosimeter)

 

Technical Specifications 2

 

Parameter	Model: HY-XR5010 (2D) Standard Version	Model: HY-XR5010 (2D) Professional Edition	Model: HY-XR5010 (2D) Premium Edition
Equipment Performance
Overall Dimensions	1700mm (L) × 1100mm (W) × 1800mm (H)
Machine Weight	800 Kg
Power Supply	110V/220V/10A
Power Consumption	1.5 Kw
Tilt Angle	± 0°
Product Input (Optional)	Manual / Automatic Barcode Scanning
Effective Inspection Range	450mm × 410mm
Inspection Method	Manual / Algorithm-based Inspection
Stage Size	510mm × 460mm
Max. Stage Load	5 Kg
Radiation Level	< 1 µSv/h
Number of Axes	4 axes
X-Ray Source Performance
Tube Model	CNT Series	L Series
Tube Type	Carbon Nano Tube (CNT) Closed Tube	Reflective Closed Tube
Max. Tube Voltage	90 Kv	90 Kv
Max. Tube Current	150 µA	200 µA
Emission Angle	90°	30° – 80°
Min. Resolution	3–15 µm	5–15 µm
Flat Panel Detector Performance
Detector Model	Whale Series	NDT Series	MFG Series
Detector Type	Amorphous Silicon	New TFT	Amorphous Silicon
Resolution	4.0 Lp/mm	5.8 Lp/mm	10 Lp/mm
Pixel Size	125 µm	85 µm	49.5 µm
Pixel Matrix	1024mm × 1248mm	1536mm × 1536mm	2312mm × 2904mm
Effective Imaging Area	160mm × 128mm	130mm × 130mm	114mm × 143mm
A/D Conversion Bit Depth	16 bit	16 bit	14 bit
Frame Rate (1×1)	30 fps	20 fps	10 fps
Features & Applications	Suitable for foreign object detection in the food industry, solder joint quality and void inspection in 3C electronics, and internal structure inspection in the semiconductor industry.	Mainly used for internal structure and dimensional inspection of products, with accuracy up to 0.01mm. Widely used as high-precision measurement equipment in PCBA and new energy fields.	Designed for products with intricate structures and high precision requirements. Used in high-end electronics inspection, including gold wire and copper wire bonding inspection in the semiconductor industry.

 

Component Description

 

No.	Function Name	Main Components
1	X-ray Detection and Imaging System	X-ray tube, flat-panel detector
2	X-ray Radiation Protection System	Lead-shielded enclosure
3	Motion Control System	X/Y moving stage, motion control card
4	Image Processing System	Proprietary image processing and inspection software developed by Zhengye
5	Navigation System	High-definition camera
6	Software Functions	Offline measurement mode, automatic navigation, manual observation, manual judgment. The automatic judgment function is provided as a complimentary feature and is not included as an acceptance item.

 

Process Operation Flow Requirements

 

Step	Operation Description
1	Manual loading of materials by opening the door
2	Manually place the test product and fixture onto the carrier stage
3	Manually close the door and activate the X-ray source
4	Locate the initial position of the test object using the navigation function
5	The carrier stage moves along the pre-programmed path
6	The X-Ray equipment performs automatic imaging
7	The operator judges the result (OK/NG) based on the image and marks the product
8	The software stores the judgment results and displays the corresponding result images
9	Deactivate the X-ray source, open the door manually, and sort the products

 

General Equipment Configuration and Standards

 

Item	Specification
Equipment Color	Main body: RAL 9016 White (or subject to customer-provided color swatch)
Safety Standards	Compliant with relevant safety standards for electromechanical equipment of the People’s Republic of China
Noise Level	≤ 75 dB (measured at 1 m from the equipment surface)
Operating Temperature	25 ± 3°C
Operating Humidity	≤ 60% RH (non-condensing)
Power Consumption	≤ 2 kW
Equipment Dimensions	L 1270 mm × W 1340 mm × H 1800 mm (final dimensions subject to actual product)