Ultra High-Precision 3D Industrial CT for Multi-Industry Non-Destructive X-Ray Inspection

Product Introduction

Ultra High-Precision Full 3D Industrial CT — HY-XR8001 system enables offline scanning and imaging for product Regions of Interest (ROI). After 3D reconstruction, our dedicated visualization analysis software delivers precise analytical measurement. Ideal for in-process quality control, failure analysis and laboratory research, the system performs fully non-destructive testing to visualize internal product structures and hidden defects, with complete measurement and analytical capabilities. Without damaging test samples, you can clearly observe internal structures, detect invisible flaws and carry out quantitative measurement & data analysis efficiently. It delivers reliable inspection solutions covering new energy, automotive, aerospace, electronics, material research and cultural relic protection industries.

Product Application

Product Features

1. High Resolution

Achieve a maximum imaging resolution of up to 2μm.

2. Wide Compatibility

With customized fixtures, it supports scanning of workpieces within the dimension of Φ600×800 mm.

3. Automatic Image Enhancement

Automatically enhance slice images after CT reconstruction.

4. Superior Precision

The precision system adopts marble as the main frame, paired with precision linear guides, high-accuracy rotary stages and high-sensitivity sensors to guarantee outstanding overall measurement precision.

5. 3D Visualization

Reconstructed 3D models support high-definition rendering and full-view display, with a full set of multi-functional analysis tools for intuitive defect location and marking.

Inspection Result Images

1.

 

2.Capacitor Inspection

 

3.Prismatic Cell Inspection

 

4.Tab Condition Inspection

 

6.Electrode Folding/Overhang

7.Electrode Damage/Cracking  and  Foreign Material Contamination on Electrode

9.Void Defects After Wafer Bonding

 

 

Technical Specifications

 

Item			Parameter
Model			HY-XR8001
Inspection Objects			New energy batteries, electronic products, castings, aerospace components, cultural relics, etc.
Imaging Specifications	Imaging Method		3D tomography using multiple projection images
	Imaging Resolution		Up to 2 µm (selectable based on inspection object)
	X-ray Tube		Open tube
	Flat Panel Detector		FPD (Flat Panel Detector)
Scanning Modes			Digital Radiography (DR)
			Cone beam scanning, helical scanning, offset scanning, etc.
JTDA Card Resolution (Image Definition)			≤ 2 µm
Geometric Magnification			≥ 177×
Inspection Object Specifications		Product Weight	≤ 50 kg
		Product Dimensions	≤ 4600 mm × 800 mm
		Max. Inspection Area	4600 mm × 800 mm
Measurement Functions			Customizable based on user requirements
Equipment Specifications		Overall Dimensions	2800 mm × 2000 mm × 2400 mm (excluding monitor)
		Weight	Approx. 12 tons
		Power Supply	AC 380/220 V ±10%, 50 Hz
		Power Consumption	10 kW
		Air Pressure	0.4–0.6 MPa
		Motion Control	Mouse, joystick, keyboard
		Main Unit	Industrial workstation PC
		Radiation Leakage Rate	< 0.5 µSv/h