Dispensing and Die Bonding Machine

HY-PB300 Fully Automatic Epoxy Die Bonder is designed for multi-chip packaging applications. It integrates precision dispensing, die placement, upper and lower vision positioning, flexible PR recognition and accurate force control, providing stable and efficient assembly for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.

HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH. 

HY-MD561P is developed for COB/COC multi-chip packaging. Equipped with linear motor and CCD vision positioning system, three independent pick-and-place heads, it supports auto feeding of 6-inch wafers and 2-inch waffle packs. Built-in through vision correction; optional syringe dispensing and UV curing systems can be configured to realize chip-substrate bonding.