What Are You Looking For?
HY-PB300 Fully Automatic Epoxy Die Bonder is designed for multi-chip packaging applications. It integrates precision dispensing, die placement, upper and lower vision positioning, flexible PR recognition and accurate force control, providing stable and efficient assembly for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.
Brand :
HYRNUSItem No. :
HY-PB300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAutomatic Deep-Cavity Multi-Chip Epoxy Die Bonder
Product Introduction
HY-PB300 Fully Automatic Epoxy Die Bonder is specifically designed for multi-chip fully automatic placement processes in the packaging of electronic components and is recognized as a critical piece of equipment in electronic component manufacturing. It is primarily used in the assembly of hybrid circuits, COB (Chip-on-Board) modules, MCMs (Multi-Chip Modules), MEMS devices, RF devices/modules, optoelectronic components, microwave devices, military-grade components, high-end optoelectronic devices, and automotive electronic modules.
Equipment Performance
| No. | Feature |
| 1 | Supports flexible multi-reference die bonding |
| 2 | High-precision force control, accuracy up to ±2 g |
| 3 | Intermediate stage assisted high-precision positioning function (optional) |
| 4 | Upper and lower vision high-precision positioning function |
| 5 | Conveyor line operation, selectable worktable modes |
| 6 | Fast and precise horizontal rotary indexing head |
| 7 | Flexible process flow, supports free combination of process steps, allows individual disabling |
| 8 | Integrated in-line contact height measurement, supports dispensing needle height measurement |
| 9 | Multiple common pre-pattern dispensing patterns, supports custom dispensing patterns and pattern overlay (optional) |
| 10 | Multiple PR recognition methods (template matching, edge positioning, reference pattern positioning, geometric center positioning, etc.) |
Technical Specifications
| No. | Parameter | Specification |
| 1. | Position Accuracy | ±3 μm @ 3σ |
| 2. | Angle Accuracy | ±0.15° @ 3σ |
| 3. | Distance Measurement Accuracy | ±1 μm |
| 4. | Chip Size | Min: 0.2mm × 0.2mm, Max: 15mm × 15mm |
| 5. | Waffle Tray / Plate Size | 2 inch, compatible with 4 inch |
| 6. | Waffle Tray / Plate Quantity | 30 units of 2 inch, or 22 units of 2 inch + 20 units of 4 inch |
| 7. | Max. Cavity Depth | 15 mm |
| 8. | Number of Nozzles | 12 (including height measurement) |
| 9. | Travel Range | X-axis 386mm, Y-axis 716mm, Z-axis 50mm |
| 10. | Dispensing Valve | Wuwei Precision Electric Control Valve SUPER-ZCMIII |
| 11. | Input Voltage | 220V ± 10% @ 50/60Hz |
| 12. | Rated Power | 1 kW |
| 13. | Footprint (W×D×H) | 970mm × 1570mm × 2040mm |
| 14. | Calibration Range | Max. 15 mm |
| 15. | Height Measurement Method | Contact type |
| 16. | Adhesive Type | Epoxy |
| 17. | Syringe Size | 3cc, 5cc, 10cc |
| 18. | Minimum Dispensing Needle Diameter | Ø0.25 mm |
| 19. | Bonding Force | 15~500 g |
| 20. | Force Control Accuracy | ±2 g |
| 21. | UPH | 1200 (pick & place only) |
| 22. | Operating System | Windows |
| 23. | Compressed Air Requirement | 0.4~0.6 MPa |
| 24. | Vacuum Line Pressure | ≤ -85 kPa |
Terms of Use
| No | Item | Requirements |
| 1. | Footprint (W×D×H) | 970mm × 1570mm × 2040mm (excluding monitor space) |
| 2. | Equipment Weight | 1600 kg |
| 3. | Ambient Temperature | Normal room temperature (20°C ~ 24°C); high temperature operation will affect equipment service life |
| 4. | Compressed Air Requirement | 0.4~0.6 MPa, flow rate >150 L/min (dry treatment, dust removal, oil-water separation, pressure regulation); air hose outer diameter: 10 mm |
| 5. | Vacuum Line Pressure | ≤ -85 kPa |
| 6. | Ambient Humidity | <60% relative humidity |
| 7. | Ambient Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 8. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 9. | Others | - Ensure power supply is located near the machine |
| - Precision leveling with a leveling instrument is required after installation on site | ||
| - Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination | ||
| - Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination | ||
| 10. | Voltage | AC 220V ± 10% |
| 11. | Frequency | 50/60 Hz |
| 12. | Grounding | Must be grounded |
| 13. | Power | ≥ 1000 W |
| 14. | Interface Specification | 10A, Single-phase 3-wire |
Product Details
HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.
HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications.
HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-ED003 Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications.
HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications.
HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
leave a message
Scan To Wechat :
Scan To WhatsApp :
