Automatic Epoxy Dispensing and Die Bonder For Multi-Chip Packaging Process

Product Introduction

HY-MD561P Automatic Epoxy Dispensing and Die Bonder is specially developed for high-precision multi-chip mounting and packaging of COB and COC processes, which realizes substrate-chip bonding through integrated dispensing and die attach workflows.

It features a full closed-loop linear motor drive structure and high-precision CCD vision positioning system to deliver consistent placement accuracy. Three independent pick-and-place heads are equipped, each fitted with an individual suction nozzle to pick chips separately for multi-chip die bonding.

The standard dispensing system includes 3 independent dispensing heads and a rotary glue plate to maintain stable glue output. The machine supports automatic feeding of 3 pcs 6-inch wafers and 6 standard 2-inch waffle packs, paired with an automatic substrate cage loading system for uninterrupted material supply.

A built-in through vision function enables secondary material re-calibration prior to placement to prevent alignment deviation.

Component List

Product Functions & Features

1. Suitable for packaging processes requiring high-precision multi-chip mounting

2. Applied to COB/COC processes for bonding substrates and chips through integrated dispensing and die attach procedures

3. Adopts linear motor structure and high-precision CCD recognition positioning system to ensure stable mounting accuracy

4. Equipped with three independent pick-and-place heads to realize multi-chip die bonding

5. Compatible with 6 standard 2-inch waffle packs and 3 pieces of 6-inch wafers as chip feeding materials

6. Fitted with an automatic substrate cage loading system

7. Built-in through vision function to re-calibrate materials before chip placement

8. Syringe dispensing module and UV curing system can be added as optional configurations

Main Component Overview

 

Module Name	Brief Introduction
Manipulator Die Attach System	X-axis marble base with linear motor & 0.5μm grating full closed-loop system; Y-axis precision lead screw, repeat accuracy ≤±1μm. Bakelite nozzles avoid chip damage, bonding pressure 10–50g.
Pick-and-Place Assembly	3 independent nozzles with rotation compensation and buffer structure, 10–50g mechanical pressure control. Flow monitoring detects chips; through vision supported.
Wafer & Tray Assembly	Wafer stroke X470×Y210mm; compatible with 3pcs 6-inch wafers & 6pcs 2-inch waffle packs. Two chip separation modes: film pulling / ejector lifting.
Chip Calibration Worktable	GMT 3-axis XYθ motor compensation; backside vision positioning via nozzle rotation; equipped with pressure calibration system.
Substrate XY Platform	Linear motor + 0.1μm grating full closed-loop structure, repeat positioning accuracy ≤±1μm.
Material Feeding Types	6-inch wafers, 2-inch waffle packs, substrate trays.
CCD Vision System	4 sets Hikvision 5MP cameras with auto-focus & 0.6–7X auto zoom, adjustable multi-type LED lights. Through vision lens for secondary alignment compensation.
Dispensing System	3 independent dispensing heads with rotary glue scraper for stable glue output; compatible with syringe dispensing.
Monitoring & UV Curing System	Real-time placement & curing monitoring; UV lamp curing module is optional for online curing.

 

Technical Specifications

 

Item	Details
Equipment Dimensions	X: 1470 mm, Y: 1470 mm, Z: 1880 mm
Weight	850 kg
Power	2 kW
Air Pressure	0.4 ~ 0.6 MPa
Voltage	220 V
Positioning Accuracy	±5 μm
Angle Accuracy	±0.2°
Die Bonding Pressure	10 ~ 50 g
Wafer Size	3 pcs 6-inch wafers (6 pcs trays, 2"×2")
Substrate Stage Travel	X: 200 mm, Y: 200 mm
Chip Size	0.2 ~ 4 mm
Single Dispensing Time	1.2 sec
Single Die Bonding Time	4 sec
Tray Loading/Unloading Time	10 sec