Plasma Surface Treatment Equipment

HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.  

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.