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HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage.
Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
Brand :
HYRNUSItem No. :
HY-AC1000HOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHorizontal Inline Rotary Atmospheric Plasma Cleaner for Continuous Production of Substrates and Lead Frames
Product Introduction
HY-AC1000H Horizontal Inline Rotary Atmospheric Plasma Cleaner comes with customizable moving rails and dual rotary spray guns for vacuum-free atmospheric low-temperature plasma treatment. Its zero-potential plasma prevents damage to delicate electronic parts. Combined physical & chemical cleaning strips mold release agents, photoresist residues, oil and surface oxides to strengthen adhesion during die attach, wire bonding, underfill and molding, reducing delamination, voids and printing failures.
Supporting manual and IO control, it connects to full-auto lines for continuous treatment of substrates, lead frames and large FPC panels. Built-in digital real-time monitoring delivers ultra-fast response below 0.1s and stable long-hour full-load production.
Product Application
HY-AC1000H rotary atmospheric plasma cleaning machine delivers efficient surface cleaning and activation for multiple industries. It handles precision pretreatment for electronics, semiconductors, 3C products and LED components, removing contaminants to strengthen bonding and packaging yields. It also serves automotive parts, lithium batteries, plastic, metal and glass workpieces, solving poor adhesion issues in printing, coating and gluing. Besides, this plasma surface treatment equipment fits home appliances, medical supplies, ceramics and textiles for all-round industrial surface modification.
Product Features
1. Military-grade hardware design, operating ambient temperature range from -25°C to 50°C, adaptable to various harsh working scenarios. MTBF (Mean Time Between Failures) ≥ 190Khrs under MIL-HDBK-217F standard at 25°C.
2. Digital control & digital display, real-time monitoring, strong anti-interference capability.
3. Built-in functions including air pressure detection, mainboard temperature detection and power adjustment.
4. Integrated control with patented intelligent chip, real-time monitoring, response time less than 0.1s and excellent anti-interference performance.
5. Plasma power factor ≥ 79%, featuring high power factor, stable dynamic balance and high electrode discharge saturation.
6. Multiple protective functions: over-temperature protection, overload protection, short-circuit protection, open-circuit protection, leakage protection and misoperation protection.
Equipment Structure
The atmospheric direct plasma surface treatment system consists of three core parts: power generator, direct plasma spray gun and control system.
1. Power Generator
It realizes automatic power matching to deliver stable and high-precision power output, free from air pressure fluctuation. Parameters can be adjusted according to actual workpieces for optimal treatment results.
2. Direct Plasma Spray Gun
Designed for small-sized and irregular materials with an effective treatment width of 20mm-80mm. It can be integrated into existing production lines for fully automatic inline processing and labor cost reduction.
3. Control System
Built inside the power generator main unit, it manages machine operation and provides full-system protection.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Parameter |
| Model | HY-AC1000H |
| Overall Dimension | 466*450*177mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC 220V |
| Power Frequency | 25KHZ |
| Plasma Output Power | 0–1000W, adjustable & displayable |
| Control Mode | I/O control / Manual control |
| Protection & Alarm Functions | Protection against over-temperature, air pressure abnormality, overload, electric leakage, short circuit, open circuit, etc. |
| Detection Functions | Air pressure detection, power detection, mainboard temperature detection |
(2) Direct Injection Plasma Spray Gun Specifications
| Item | Parameter |
| Spray Gun Dimension | 314.5*95mm |
| Standard Nozzle Sizes | 20mm, 40mm, 60mm, 80mm |
| Plasma Cleaning Working Height | 5–20mm |
| Effective Plasma Treatment Width | 20–80mm |
| Air Pressure Range | Standard: 0.2Mpa, adjustable within 0.08–0.25Mpa |
2. Factory Installation Requirements
| Item | Requirement |
| Power Supply Required | Single-phase AC220V, 10A; grounding resistance less than 4Ω |
| Facility Exhaust | Flow rate: 5m³/min; material: corrosion-resistant material |
| Facility Compressed Air Requirements | Pipe diameter: 8mm |
| Pipe material: PU tube | |
| Pressure: 0.4–0.6MPa | |
| Air source quality requirements: | |
| Solid particle diameter ≤0.1μm, | |
| Oil content ≤0.01mg/m³, | |
| Dew point ≤ -40℃ |
| Item | Content |
| Hazard Marking | High voltage hazard label |
| Operating Environment | Temperature: 15~35°C |
| Humidity: 30~80% | |
| Other Notes | Combustible gas, corrosive gas, explosive or reactive dust are prohibited in the working area |
Product Details
The HY-AC1000H comes standard with 2 rotary spray guns to greatly boost mass production efficiency. It adopts a horizontal round rotary design that fits wide flat conveyor lines. Its power ranges from 0 to 1000W with interchangeable 20–80mm round nozzles for uniform large-area plasma activation.
Yes. Custom mobile track structures are available to match various production requirements. It supports both IO automatic control and manual control, and can be seamlessly integrated into coating, dispensing and printing inline lines without vacuum chambers
It needs 8mm PU tubes for dry and clean compressed air (0.4–0.6MPa, dew point ≤-40°C, oil content ≤0.01mg/m³). Corrosion-resistant exhaust pipes with a flow rate of 5m³/min are required, and the workshop environment should maintain 15–35°C temperature and 30–80% humidity.
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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