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HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.
Brand :
HYRNUSItem No. :
HY-AR03Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAtmospheric Jet Plasma Cleaning Equipment for IC Packaging Pre-treatment Surface Activation
Product Introduction
HY-AR03 Atmospheric Pressure Direct Jet Plasma Cleaning Machine works under normal atmospheric pressure to modify substrate surface properties and eliminate surface contaminants. It serves as vital pre-processing equipment for encapsulation, lamination, film coating, welding and adhesive dispensing, and can be seamlessly installed on automated assembly lines for uninterrupted mass manufacturing.
Adopting military-grade hardware, the machine works stably across -25℃~50℃ with MTBF up to 190,000 hours. Equipped with digital touchscreen real-time monitoring and embedded ST ARM chip, it supports RS485 remote communication, multi-item real-time data detection and full-range multi-fault safety protection for long-term industrial operation.
Product Application
It serves as essential pre-treatment equipment for semiconductor and electronics manufacturing procedures including printing, encapsulation, lamination, film coating, welding and adhesive dispensing. It can be seamlessly integrated into automated assembly lines to realize uninterrupted continuous mass production at low operation costs.
Product Features
1. Adopts military-grade hardware design, supporting operating temperature from -25℃ to 50℃ to adapt to harsh working environments. Its MTBF (Mean Time Between Failures) reaches ≥190,000 hours in accordance with MIL-HDBK-217F standard at 25℃.
2. Digital control system with touch display for real-time monitoring and outstanding anti-interference performance.
3. Equipped with ST ARM chip to enable powerful remote debugging and communication for seamless line integration. Self-developed intelligent software analyzes real-time collected data to realize automatic power matching and consistent stable operation.
4. Compatible with analog signal interface and RS485 remote communication.
5. Multiple real-time monitoring functions: temperature, air pressure, transformer arc voltage, transformer primary peak current, grid current and rotating speed detection.
6. Full-range safety protection including over-temperature, overload, short circuit, open circuit, electric leakage and misoperation protection.
Product Dimension Diagram
Technical Specifications
| Item | Parameter |
| Product Name | Atmospheric Vortex Jet Plasma Cleaning Machine |
| Model No. | NE-ATR03 |
| Power Output Range | 450~1200W (adjustable), precise power control with high stability |
| Treatment Width | 50 mm |
| Treatment Height | 5–15 mm |
| Processing Speed | 10–300 mm/s |
| Treatment Temperature | 50℃ ~ 100℃ |
| Air Consumption | 50 L/min @ 0.1MPa; 85 L/min @ 0.2MPa |
| High Voltage Cable Length | 3 m |
| Power Output Accuracy | ±1% |
| Control Mode | Digital Control |
| Overall Dimension | WDH: 244mm474mm310mm |
| Torch Weight | 5 KG |
| Machine Weight | 25 KG |
| Input Power Supply | 220VAC±20%, 50–60Hz |
| Operation Control | Local Control & Remote Control |
| Remote Communication | Analog interface & RS485 communication interface |
| Power Factor | 95% |
| Input Air Pressure | 0.4MPa ~ 0.6MPa, tolerance ±20% |
| Output Air Pressure | 0.1MPa ~ 0.2MPa, tolerance ±20% |
| Power Board | Modularized |
| Anti-Interference Performance | Excellent |
| Real-Time Data Monitoring Items | Air pressure, mainboard temperature, transformer arc voltage, operating current, operating voltage, actual power, power consumption, operating frequency, power factor |
| Fault Alarm Types | Short circuit, open circuit, over-temperature, air pressure failure, system overcurrent, system undervoltage, system overvoltage, high-voltage output open circuit, high-voltage output short circuit, AC input fault, torch abnormality |
| Alarm Notification Modes | Audible buzzer + touch screen pop-up prompt |
Factory Utility Specifications
| Item | Requirement |
| AC Power Supply Spec | Single-phase AC220V, 50/60Hz, 11A; Ground resistance less than 4Ω |
| Factory Exhaust | Flow rate: 5m³/min |
| Pipe material: Corrosion-resistant material | |
| Factory Compressed Air Requirements | Dry air free of water and oil |
| Pipe diameter: 8mm | |
| Pipe material: PU tube | |
| Air pressure: 0.4–0.6MPa |
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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