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HY-EB03H 2.5L tabletop ICP treatment unit is compact lab plasma surface treatment equipment with 13.56MHz RF power and dual gas channels. It generates high-density ICP plasma for cleaning, activating, etching and bonding materials, and is widely used for PDMS microfluidics, photoresist ashing and semiconductor lab research.
Brand :
HYRNUSItem No. :
HY-EB03HOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China2.5L Quartz Chamber Tabletop ICP Vacuum Plasma Cleaner for Laboratory Research
Product Introduction
HY-EB03H 2.5L Quartz Chamber Tabletop ICP Vacuum Plasma Cleaner is a compact plasma surface treatment system tailored for university research labs, enterprise R&D centers and small-scale pilot production. Equipped with a cylindrical quartz glass processing chamber, the complete system consists of an RF plasma generator, vacuum pump and dual independent gas inlet & outlet ports. Adopting ICP inductively coupled plasma technology, it can stably produce uniform high-density plasma.
This equipment effectively improves substrate surface adhesion and optimizes surface hydrophilicity, and is extensively applied to PDMS microfluidic chip bonding, material coating, thin film deposition, photoresist stripping and a full range of material surface modification processes.
Product Application
1. Cleaning: Removal of organics, oxides, metal salts, nano-scale particulate contaminants, etc.
2. Activation: Hydrophilic/hydrophobic modification, surface energy improvement, functional group introduction, biocompatibility optimization, etc.
3. Etching: Surface patterning, micro-etching, adjustment of surface morphology and roughness, etc.
4. Bonding: Bonding of PDMS and other microfluidic devices
5. Photoresist Stripping: Photoresist ashing and bottom layer stripping
Product Features
1. The vacuum chamber is made of quartz glass, easy to clean and free of contamination to test samples.
2. Equipped with a 13.56MHz solid-state RF plasma generator with automatic impedance matching tuning, delivering excellent stability and repeatability.
3. The operation panel adopts a 30° inclined ergonomic design for easy operation and user-friendly interface.
4. Two independent gas channels fitted with mass flow controllers allow precise setting and regulation of gas flow rates, facilitating research on how different gas ratios affect treatment results.
5. ICP inductively coupled plasma generation technology generates high-density plasma.
Machine Outline Drawing and Vacuum Chamber Diagram
Technical Specifications
| No. | Item | Spec. | Parameter |
| 1 | Plasma Generator | Solid-state Power Output | 0–15W continuously adjustable, standard sine wave output, stability ≤±0.5%; with overvoltage, overcurrent, overtemperature and reflected power protection |
| Operating Frequency | 13.56 MHz solid-state RF power supply | ||
| Impedance Matching | High-speed automatic matching within 0.1s, supports network communication | ||
| 2 | Vacuum Reaction Chamber | Chamber Material | Heat-resistant quartz glass |
| Chamber Volume | 2.5L | ||
| Sample Tray | Parallel glass tray | ||
| Cylindrical Chamber Dimension | Φ105×300 (D) mm | ||
| 3 | Gas Path Control | Mass Flow Controller | 300 SCCM |
| Gas Channels | 2 independent gas lines, compatible with O₂, Ar, N₂, H₂, etc. | ||
| Please inform us in advance if corrosive gas is required | |||
| 4 | Vacuum Measurement | Vacuum Measuring System | Measuring range: 5×10⁻² ~ 1.0×10⁵ Pa |
| Measurement accuracy: 1 Pa | |||
| 5 | Pumping System | Vacuum Pump | 8 m³/H |
| 6 | Control System | Touch Screen | 7-inch |
| Real-time Monitoring Items | Output power, vacuum level, gas flow, processing time, etc. | ||
| Control Mode | PLC control | ||
| Control Software | Self-developed patented plasma control system with 3-level access authority; auto & manual mode, recipe parameter setting, saving & recalling, alarm history query, IO signal monitoring | ||
| Alarm Protection Functions | Vacuum protection alarm, glow discharge protection alarm, power protection alarm | ||
| Pressure Balancing Function | Supports process gas inlet for pressure equalization, balance duration adjustable | ||
| 7 | Site Operation Conditions | Power Supply | 220V±10% 50/60Hz 9A |
| Gas Pipe Fitting | 6mm diameter port | ||
| Required Gas Purity | 99.99% | ||
| Inlet Gas Pressure | 0.4–0.6 MPa | ||
| Exhaust Port | KF25 flange interface | ||
| 8 | Overall Machine Parameters | Total Machine Power | ≤ 2 kW |
| Overall Outer Dimensions | 551.5mm(L) × 480mm(W) × 546.5mm(H) |
Operating Environment (Items to be Prepared by Customer)
| No. | Item | Requirements |
| 1 | Power Supply & Power Rating | Input grid: 220V, 50/60Hz, allowable grid fluctuation ±10%; power ground wire shall meet international standards. No strong electromagnetic interference around the equipment installation area. |
| 2 | Installation Environment | Ambient temperature: 0–40°C; Relative humidity: 15%–60% |
| 3 | Gas Source Preparation | Gas cylinders for O₂, Ar, N₂, H₂, etc. (must be equipped with pressure reducing valves). Inlet gas pressure ＞0.3 MPa; gas pipe port diameter: Φ6mm |
| 4 | Exhaust Duct | Connect to the exhaust port of vacuum pump (mandatory for cleanroom use) |
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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