Plasma Treatment System

HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports. It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.

HY-AR03 performs workpiece surface cleaning, activation and modification under ambient air. It optimizes substrate adhesion, hydrophilicity and printability, and removes organic residues, oil stains and oxide layers. Ideal as pre-treatment equipment for IC packaging, printing, bonding and coating processes, this compact unit supports inline automated production with low operating costs.

 HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.