What Are You Looking For?
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects.
Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
Brand :
HYRNUSItem No. :
HY-AS1200Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAtmospheric Low-Temperature Rotary Square Plasma Cleaner for IC Packaging and Semiconductor Testing
Product Introduction
HY-AS1200 Atmospheric Low-Temperature Rotary Square Plasma Cleaner is equipped with a high-speed rotating nozzle to deliver full, consistent plasma coverage across workpieces. It offers an effective treatment width of 20–80 mm with a maximum 1200 W stepless adjustable power, significantly improving processing throughput for large substrates and lead frames in high-volume semiconductor manufacturing. Operating without vacuum chambers, its low-potential cold plasma safeguards fragile chip circuitry while efficiently stripping mold release agents, residual photoresist and surface metal oxides. This greatly enhances interfacial adhesion for die attach, wire bonding, underfill and molding compound, effectively minimizing delamination, voids and poor bonding issues to maintain stable packaging yield.
The machine supports IO signal automatic control and comprehensive hardware & software safety interlocks. It can be seamlessly integrated into front-to-back inline production workflows, making it a standard inline pre-treatment solution for IC packaging, Mini LED packaging, power semiconductor devices and automotive chip packaging and testing factories.
Product Application
This equipment is mainly designed for the semiconductor industry. It provides cleaning and activation before die bonding, wire bonding, molding and dispensing, cleans wafers, lead frames and BGA substrates to remove oily dirt and organic particles, and improves packaging adhesion and production yield.
It is also widely applied in 3C display, camera module, PCB/FPC, LED, automotive, new energy and other fields. For plastic, glass, ceramic, metal, PI, ITO and special materials, it realizes surface cleaning and activation before bonding, printing, coating and welding to eliminate poor adhesion, packaging voids and printing defects.
Product Features
1. Designed with military-grade hardware components, the machine runs stably at ambient temperatures ranging from -25°C up to 50°C, suitable for diverse harsh production environments. Per MIL-HDBK-217F criteria at 25°C, its MTBF value surpasses 190K hours.
2. Digitalized operation & display system provides continuous real-time monitoring while resisting external signal interference effectively.
3. Multiple practical functional modules are available: air pressure monitoring, motherboard temperature sensing and adjustable output power.
4. Adopts self-developed intelligent chip integrated control system, featuring real-time data feedback within 0.1s and strong resistance to signal disturbance.
5. Boasts a plasma power factor of no less than 79%, characterized by smooth dynamic balance and high saturation during electrode discharging.
6. Equipped with a full set of safety protection functions, including over-temperature, overloading, short circuit, open circuit, leakage and misoperation prevention.
Equipment Structure
The atmospheric rotary plasma surface processing unit is composed of three core functional parts: power generation module, rotary plasma spray gun and control system.
1. Power Generation Module
It is equipped with automatic power matching to output stable and high-precision power free from gas pressure variation. Operators can adjust running parameters according to real sample conditions to gain perfect surface processing effects.
2. Direct Plasma Spray Gun
This gun is designed for large-area and complicated irregular materials, with effective processing width of 20mm to 80mm. It can coordinate with original production lines to realize fully automatic online production and reduce labor costs.
3. Control System
The control system is installed inside the main cabinet of the power generator. It manages the operation of the atmospheric plasma cleaner and delivers full safety protection for the whole equipment system.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Specification |
| Model | HY-AS1200 |
| Overall Dimension | 479200325mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC220V |
| Power Frequency | 25KHz |
| Plasma Output Power | 0–1200W, adjustable & displayable |
| Control Mode | IO Control / Manual Control |
| Protection & Alarm | Built-in protection functions for temperature, air pressure, overload, electric leakage, short circuit, open circuit, etc. |
| Detection Functions | Air pressure detection, power detection, mainboard temperature detection |
(2) Direct Injection Plasma Spray Gun Specifications
| Item | Specification |
| Plasma Gun Dimensions | 324mm*86.5mm |
| Nozzle Sizes | Standard: 20mm, 30mm, 50mm, 56mm, 60mm, 80mm |
| Plasma Treatment Height | 5–20mm |
| Effective Plasma Treatment Width | 20–80mm |
| Air Pressure Range | Standard: 0.2MPa, adjustable within 0.08–0.25MPa |
2. Factory Installation Requirements
| Item | Requirement |
| Power Supply Required | Single-phase AC220V, 10A; Ground resistance less than 4Ω |
| Factory Exhaust | Flow rate: 5m³/min; Pipe material: Corrosion-resistant material |
| Factory Compressed Air Requirements | Pipe diameter: 8mm |
| Pipe material: PU tube | |
| Working pressure: 0.4–0.6MPa | |
| Air quality standard: | |
| Solid particle diameter ≤0.1μm | |
| Oil content ≤0.01mg/m³ | |
| Dew point ≤ -40°C |
| Item | Specification |
| Hazard Marking | High Voltage Warning Label |
| Operating Environment | Temperature: 15~35°C |
| Humidity: 30~80% | |
| Other Precautions | No flammable gas, corrosive gas, explosive or reactive dust in the working area |
Product Details
The HY-AS1200 rotary plasma cleaner is widely used in semiconductor IC packaging, 3C electronics, automotive electronics, new energy and LED manufacturing. It treats wafers, FPC/PCB, plastics, glass and metals to solve poor adhesion, printing peeling, packaging delamination and void defects.
This unit adopts zero-potential low-temperature neutral plasma technology. It creates no static breakdown or thermal damage, so it is completely safe for delicate parts such as chips, thin films and BGA substrates.
Absolutely. It supports dual control modes: IO automatic control and manual control. The rotary spray gun can be mounted on assembly lines or robotic arms for continuous mass inline production
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
