Wafer Cutting Machine

HY-WD1202 adopts imported RPS spindles, NSK precision transmission parts and Renishaw encoders for Y-axis closed-loop control with high positioning accuracy. It supports NCS height measurement, BBD blade detection, auto image recognition and on-wheel dressing, suitable for silicon, SiC/GaN wafers, ceramics, PCBs and optical glass. Applied to precision dicing for IC, power device and LED industries, the touchscreen machine has full pressure and temperature alarm protection. It offers multiple cutting modes for regular and complex workpieces, fitting for mass production in constant-temperature clean rooms.

HY-WD802 comes with dual imported high-speed spindles, coaxial & ring dual vision, built-in NCS height measurement, BBD detection and on-wheel dressing. Equipped with NSK transmission and Renishaw closed-loop linear scale for excellent positioning precision, it performs precision cutting on silicon, SiC, GaN and compound wafers for power device, IC and optoelectronic ceramic mass production.

HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.

HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.